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Showing results 1 to 6 of 6

Issue Date	Title Author(s) Journal	View
2019-03	Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care Chung, Ha Uk ; Kim, Bong Hoon ; Lee, Jong Yoon ; Lee, Jungyup ; Xie, Zhaoqian ; Ibler, Erin M. ; Lee, KunHyuck ; Banks, Anthony ; Jeong, Ji Yoon ; Kim, Jongwon ; et al American Association for the Advancement of Science, 2019-03	614
2017-03	Chemical Sensing Systems that Utilize Soft Electronics on Thin Elastomeric Substrates with Open Cellular Designs Lee, Yoon Kyeung ; Jang, Kyung In ; Ma, Yin Ji ; Koh, Ah Yeon ; Chen, Hang ; Jung, Han Na ; Kim, Ye Rim ; Kwak, Jean Won ; Wang, Liang ; Xue, Yeguang ; et al Advanced Functional Materials, v.27, no.9, 2017-03	641
2018-11	Mechanically Guided Post-Assembly of 3D Electronic Systems Kim, Bong Hoon ; Liu, Fei ; Yu, Yongjoon ; Jang, Hokyung ; Xie, Zhaoqian ; Li, Kan ; Lee, Jungyup ; Jeong, Ji Yoon ; Ryu, Arin ; Lee, Yechan ; et al Advanced Functional Materials, v.28, no.48, pp.1 - 10, 2018-11	659
2017-06	Self-assembled three dimensional network designs for soft electronics Jang, Kyung In ; Li, Kan ; Chung, Ha Uk ; Xu, Sheng ; Yang, Yiyuan ; Kwak, Jean Won ; Jung, Han Hee ; Song, Ju Won ; Yang, Ce ; Wang, Ao ; et al Nature Communications, v.8, 2017-06	883
2018-11	The equivalent medium of cellular substrate under large stretching, with applications to stretchable electronics Chen, Hang ; Zhu, Feng ; Jang, Kyung-In ; Feng, Xue ; Rogers, John A. ; Zhang, Yihui ; Huang, Yonggang ; Ma, Yinji Journal of the Mechanics and Physics of Solids, v.120, pp.199 - 207, 2018-11	623
2018-05	Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process Kim, Bong Hoon ; Lee, Jungyup ; Won, Sang Min ; Xie, Zhaoqian ; Chang, Jan-Kai ; Yu, Yongjoon ; Cho, Youn Kyoung ; Jang, Hokyung ; Jeong, Ji Yoon ; Lee, Yechan ; et al ACS Nano, v.12, no.5, pp.4164 - 4171, 2018-05	616

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