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Showing results 1 to 5 of 5

Issue Date	Title Author(s) Journal	View
2014-07	Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package Kim, Sangwon ; Lee, Junman ; Nam, Jaewoo ; Kim, Bonghwan ; Cho, Chanseob ; Kim, Jung Yup ; Choi, Hongsoo Korean Society of Mechanical Engineers, 2014-07	750
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	615
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	591
2011	Photovoltaic efficiency characteristics of DSSC with electroplated Pt/Ni counter electrode Hwang, Ki-Seob ; Doh, Seok-Joo ; Ha, Ki-Ryong The Korean Society of Industrial and Engineering Chemistry, 2011	508
2022-12	Washable, stretchable, and reusable core–shell metal nanowire network-based electronics on a breathable polymer nanomesh substrate Jeong, Wooseong ; Lee, Seonmin ; Choi, Hyeokjoo ; Bae, Jihoon ; Lee, Seon-Hak ; Ma, Yoohan ; Yoo, Seungsun ; Ha, Jae-Hyun ; Hong, Jung-Il ; Park, Seoyeon ; et al Materials Today, v.61, pp.30 - 39, 2022-12	155

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