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Fabrication of three dimensional mushroom shaped multi-electrode array

Title
Fabrication of three dimensional mushroom shaped multi-electrode array
Translated Title
3 차원 버섯 모양의 MEA 제작
Authors
Lee, Hyun Wook
DGIST Authors
Lee, Hyun Wook; Moon, Sang Jun; Moon, Dae Won
Advisor(s)
Moon, Sang Jun
Co-Advisor(s)
Moon, Dae Won
Issue Date
2016
Available Date
2016-02-12
Degree Date
2016. 2
Type
Thesis
Keywords
Three dimensional multi-electrode arraybrain sliceelectrical circuit modeling of cell3 차원 다채널전극뇌절편세포의 전기회로 모델링
Abstract
At present main issue of neuroscience is to ascertain the relationships between the functional connectivity-map of neuronal circuits and their physiological or pathological func-tions. Voltage clamp are developed for intracellular recording. However, the voltage clamps are limited to measure simultaneous recordings of neural activity from hundreds of individual neu-rons and monitor long-term electrophysiological information. Although Multi-electrode array (MEA) is developed and commercialized to overcome the limits, this two dimensional MEA cannot record intracellular signals. Three dimensional multi-electrode array is suggested to record intracellular signals. In this study, new 3D mushroom shaped MEA is designed. The new MEA has high electrodes density and broad contact area. The MEA is modeled as equiva-lent circuit and simulated to compare with conventional 3D MEA as multisim software. Fabrica-tion conditions of MEA are arranged and problems are analyzed in fabrication process. After this, The MEA would be used to study brain network. ⓒ 2016 DGIST
Table Of Contents
1. INTRODUCTION 1-- 1.1 Electrophysiological signals 2-- 1.2 Methodologies for the recording of neural activity 3-- 1.3 Sharp glass electrodes and patch electrodes 4-- 1.4 Two dimensional MEA 5-- 1.5 Three dimensional MEA 7-- 1.5.1 Vertical nanowire electrodes array 8-- 1.5.2 3D mushroom shaped MEA 10-- 1.6 Electro-plating 13-- 1.7 Problem and hypothesis 14-- 2. MODELING AND CIRCCUIT ANALYSIS 15-- 2.1 Modeling and circuit analysis 15-- 3. SIMULATION 19-- 3.1 Simulation 19-- 4. MATERIALS AND METHODS 22-- 4.1 Mushroom shaped 3D MEA fabrication 22-- 4.2 Brain Slice preparation 25-- 4.2.1 Mouse operation to extract brain 25-- 4.2.2 Brain slice using vibratome 27-- 4.3 MEA Analysis for brain slice 29-- 5. RESULTS AND DISCUSSION 30-- 5.1 Simulation results 30-- 5.2 Fabrication results 33-- 5.2.1 The first mask design(mask_A) 33-- 5.2.2 The first photoresist coating and develop 35-- 5.2.3 The second mask design(mask_B) 37-- 5.2.4 The second photoresist coating and develop 39-- 5.2.5 Electroplating results 43-- 6. CONCLUSION 46-- 6.1 Conclusion 46-- REFERENCES 47
URI
http://dgist.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002230655
http://hdl.handle.net/20.500.11750/1458
DOI
10.22677/thesis.2230655
Degree
Master
Department
Robotics Engineering
University
DGIST
Files:
Collection:
Robotics EngineeringThesesMaster


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