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A Reference-Less Injection-Locked Clock-Recovery Scheme for Multilevel-Signaling-Based Wideband BCC Receivers

Title
A Reference-Less Injection-Locked Clock-Recovery Scheme for Multilevel-Signaling-Based Wideband BCC Receivers
Authors
Kulkarni, VV[Kulkarni, Vishal V.]Lee, J[Lee, Junghyup]Zhou, J[Zhou, Jun]Ho, CK[Ho, Chee Keong]Cheong, JH[Cheong, Jia Hao]Toh, WD[Toh, Wei-Da]Li, P[Li, Peng]Liu, X[Liu, Xin]Je, M[Je, Minkyu]
DGIST Authors
Je, M[Je, Minkyu]
Issue Date
2014-09
Citation
IEEE Transactions on Microwave Theory and Techniques, 62(9), 1856-1866
Type
Article
Article Type
Article
Keywords
Body Channel Communication (BCC)Body Channel Communications (BCC)Clock RecoveryCmos Integrated CircuitsElectric ClocksInjection-Locked OscillatorInjection Locked OscillatorsLow Power ElectronicsMulti-Level SignalingOscillistorsWireless Body Area Network (WBAN)Wireless Local Area Networks (WLAN)
ISSN
0018-9480
Abstract
Body channel communication (BCC) integrated circuits for emerging wireless body area network multimedia applications call for the need of high-speed inter-device data communication at ultra-low-power consumption and smaller device footprint. In this paper, a novel low-power injection-locking-based clock-recovery circuit (CRC) is proposed for BCC transceivers that employ multilevel direct digital signaling for high data rates. The CRC utilizes transition detection for generating pulses from transmitted digital data and injects them directly into the VCO to recover the clock. The pulse-based direct injection-locking architecture achieves instantaneous clock recovery from random multilevel data with a sensitivity of up to-43 dBm, and eliminates the need for a reference crystal used in conventional phase-locked-loop-based CRC circuits. Measured results verify that the proposed CRC achieves clock recovery for two-and three-level signals for data rates up to 160 Mb/s. Implemented in 65-nm CMOS technology, the CRC consumes 0.84 mW with a footprint of 0.122. © 2014 IEEE.
URI
http://hdl.handle.net/20.500.11750/2645
DOI
10.1109/TMTT.2014.2342654
Publisher
Institute of Electrical and Electronics Engineers Inc.
Files:
There are no files associated with this item.
Collection:
Information and Communication EngineeringETC1. Journal Articles


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