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Reliable and cost effective design of intermetallic Ni2Si nanowires and direct characterization of its mechanical properties

Title
Reliable and cost effective design of intermetallic Ni2Si nanowires and direct characterization of its mechanical properties
Authors
Han, SZ[Han, Seung Zeon]Kang, J[Kang, Joonhee]Kim, SD[Kim, Sung-Dae]Choi, SY[Choi, Si-Young]Kim, HG[Kim, Hyung Giun]Lee, J[Lee, Jehyun]Kim, K[Kim, Kwangho]Lim, SH[Lim, Sung Hwan]Han, B[Han, Byungchan]
DGIST Authors
Kang, J[Kang, Joonhee]
Issue Date
2015-10-12
Citation
Scientific Reports, 5
Type
Article
Article Type
Article
ISSN
2045-2322
Abstract
We report that a single crystal Ni2 Si nanowire (NW) of intermetallic compound can be reliably designed using simple three-step processes: casting a ternary Cu-Ni-Si alloy, nucleate and growth of Ni2 Si NWs as embedded in the alloy matrix via designing discontinuous precipitation (DP) of Ni2 Si nanoparticles and thermal aging, and finally chemical etching to decouple the Ni2 Si NWs from the alloy matrix. By direct application of uniaxial tensile tests to the Ni2 Si NW we characterize its mechanical properties, which were rarely reported in previous literatures. Using integrated studies of first principles density functional theory (DFT) calculations, high-resolution transmission electron microscopy (HRTEM), and energy-dispersive X-ray spectroscopy (EDX) we accurately validate the experimental measurements. Our results indicate that our simple three-step method enables to design brittle Ni2 Si NW with high tensile strength of 3.0 GPa and elastic modulus of 60.6GPa. We propose that the systematic methodology pursued in this paper significantly contributes to opening innovative processes to design various kinds of low dimensional nanomaterials leading to advancement of frontiers in nanotechnology and related industry sectors.
URI
http://hdl.handle.net/20.500.11750/2833
DOI
10.1038/srep15050
Publisher
Nature Publishing Group
Files:
There are no files associated with this item.
Collection:
Energy Science and EngineeringETC1. Journal Articles


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