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Fast location of opens in TSV-based 3-D chip using simple resistor chain

Title
Fast location of opens in TSV-based 3-D chip using simple resistor chain
Authors
Hu, S.[Hu, Sanming]Jin, C.[Jin, Cheng]Li, H.[Li, Hongyu]Li, R.[Li, Rui]Chong, S.C.[Chong, Serchoong]Jong, M.C.[Jong, Mingchinq]Wai, E.L.C.[Wai, Eva]Teo, K.H.[Teo, Keng Hwa]Je, M.[Je, Min Kyu]Lo, P.G.Q.[Lo, Patrickguoqiang]
DGIST Authors
Je, M.[Je, Min Kyu]
Issue Date
2014
Citation
IEEE Transactions on Electron Devices, 61(7), 2584-2587
Type
Article
Article Type
Article
Keywords
3-D Integrated Circuit (3-D IC)ChainsElectric Power SystemsElectrical MethodsLocationOpenOpen CircuitsOrganic SubstrateParallel Resistor ChainPower SupplyResistorsThree Dimensional Integrated CircuitsThrough-Silicon-Via (TSV)Through-Silicon-Vias
ISSN
0018-9383
Abstract
This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only. © 2014 IEEE.
URI
http://hdl.handle.net/20.500.11750/3144
DOI
10.1109/TED.2014.2321453
Publisher
Institute of Electrical and Electronics Engineers Inc.
Files:
There are no files associated with this item.
Collection:
Information and Communication EngineeringETC1. Journal Articles


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