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Contact resistance of inkjet-printed silver source-drain electrodes in bottom-contact OTFTs

Title
Contact resistance of inkjet-printed silver source-drain electrodes in bottom-contact OTFTs
Authors
Chung, S.[Chung, Seung Jun]Jeong, J.[Jeong, Jae Wook]Kim, D.[Kim, Dong Hyun]Park, Y.[Park, Yun Hwan]Lee, C.[Lee, Chang Hee]Hong, Y.[Hong, Yong Taek, Y.]
DGIST Authors
Jeong, J.[Jeong, Jae Wook]
Issue Date
2012
Citation
IEEE/OSA Journal of Display Technology, 8(1), 48-53
Type
Article
Article Type
Article
Keywords
Bottom-ContactBottom-Contact Organic Thin-Film TransistorChannel LengthChemical SensorsCommon GatesContact ResistanceElectric LinesElectrodesGate Dielectric LayersGate DielectricsInkjet-PrintingOrganic SemiconductorOrganic Thin-Film Transistor (OTFT)Organic Thin Film TransistorsPentacenesResistance AnalysisSemiconducting Organic CompoundsSemiconductor LayersSilverSilver ElectrodeSinteringSintering ProcessSource-DrainSource-Drain ElectrodesSurface PropertiesThin-Film Transistors (TFTs)TransistorsTransmission Line MethodTransmission Line MethodsTransmission Line Theory
ISSN
1551-319X
Abstract
In this paper, we report contact resistance analysis between inkjet-printed silver source-drain (S/D) electrodes and organic semiconductor layer in bottom-contact organic thin-film transistors (OTFTs) using transmission line method (TLM). Inkjet-printed silver electrodes, spin-coated PVP and evaporated pentacene were used as gate and S/D electrodes, gate dielectric layer and semiconductor layer, respectively. On a common gate electrode, S/D electrodes with various channel length from 15 to 111 were printed for TLM analysis. The same bottom-contact OTFT with evaporated silver S/D electrodes was also fabricated for reference. We extracted contact resistances of 1.79 and 0.55 for inkjet-printed and evaporated silver electrodes, respectively. Higher contact resistance for inkjet-printed silver electrodes can be explained in terms of their relatively poor surface properties at electrode edge that can cause small pentacene molecule grain or slight oxidation of surface during the printed silver sintering process. © 2006 IEEE.
URI
http://hdl.handle.net/20.500.11750/3403
DOI
10.1109/JDT.2011.2174963
Publisher
IEEE Computer Society
Files:
There are no files associated with this item.
Collection:
ETC1. Journal Articles


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