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Contact resistance of inkjet-printed silver source-drain electrodes in bottom-contact OTFTs
- Contact resistance of inkjet-printed silver source-drain electrodes in bottom-contact OTFTs
- Chung, S.[Chung, Seung Jun]; Jeong, J.[Jeong, Jae Wook]; Kim, D.[Kim, Dong Hyun]; Park, Y.[Park, Yun Hwan]; Lee, C.[Lee, Chang Hee]; Hong, Y.[Hong, Yong Taek, Y.]
- DGIST Authors
- Jeong, J.[Jeong, Jae Wook]
- Issue Date
- IEEE/OSA Journal of Display Technology, 8(1), 48-53
- Article Type
- Bottom-Contact; Bottom-Contact Organic Thin-Film Transistor; Channel Length; Chemical Sensors; Common Gates; Contact Resistance; Electric Lines; Electrodes; Gate Dielectric Layers; Gate Dielectrics; Inkjet-Printing; Organic Semiconductor; Organic Thin-Film Transistor (OTFT); Organic Thin Film Transistors; Pentacenes; Resistance Analysis; Semiconducting Organic Compounds; Semiconductor Layers; Silver; Silver Electrode; Sintering; Sintering Process; Source-Drain; Source-Drain Electrodes; Surface Properties; Thin-Film Transistors (TFTs); Transistors; Transmission Line Method; Transmission Line Methods; Transmission Line Theory
- In this paper, we report contact resistance analysis between inkjet-printed silver source-drain (S/D) electrodes and organic semiconductor layer in bottom-contact organic thin-film transistors (OTFTs) using transmission line method (TLM). Inkjet-printed silver electrodes, spin-coated PVP and evaporated pentacene were used as gate and S/D electrodes, gate dielectric layer and semiconductor layer, respectively. On a common gate electrode, S/D electrodes with various channel length from 15 to 111 were printed for TLM analysis. The same bottom-contact OTFT with evaporated silver S/D electrodes was also fabricated for reference. We extracted contact resistances of 1.79 and 0.55 for inkjet-printed and evaporated silver electrodes, respectively. Higher contact resistance for inkjet-printed silver electrodes can be explained in terms of their relatively poor surface properties at electrode edge that can cause small pentacene molecule grain or slight oxidation of surface during the printed silver sintering process. © 2006 IEEE.
- IEEE Computer Society
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