Cited 2 time in webofscience Cited 2 time in scopus

Self-assembled three dimensional network designs for soft electronics

Title
Self-assembled three dimensional network designs for soft electronics
Authors
Jang, Kyung-InLi, KanChung, Ha UkXu, ShengJung, Han NaYang, YiyuanKwak, Jean WonJung, Han HeeSong, JuwonYang, CeWang, AoLiu, ZhuangjianLee, Jong YoonKim, Bong HoonKim, Jae-HwanLee, JungyupYu, YongjoonKim, Bum JunJang, HokyungYu, Ki JunKim, JeonghyunLee, Jung WooJeong, Jae-WoongSong, Young MinHuang, YonggangZhang, YihuiRogers, John A.
DGIST Authors
Jang, Kyung-In; Jung, Han Hee; Song, Juwon
Issue Date
2017-06-21
Citation
Nature Communications, 8
Type
Article
Article Type
Article
Keywords
Artificial MusclesBatteriesBioelectronicsElastic ConductorsInterconnectsSkinStretchable ElectronicsSystemsTechnologiesTransparent
ISSN
2041-1723
Abstract
Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors. © 2017 The Author(s).
URI
http://hdl.handle.net/20.500.11750/4146
DOI
10.1038/ncomms15894
Publisher
Nature Publishing Group
Related Researcher
  • Author Jang, Kyung In Bio-embedded Electronics Lab
  • Research Interests Extreme mechanics; Stand-alone electronics; Heterogeneous materials; Biocompatible interfaces
Files:
There are no files associated with this item.
Collection:
ETC1. Journal Articles


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