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Issue Date	Title Author(s) Journal	View
2015	Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization Choi, Sang Kyung ; Kim, Han Gil ; Kim, Jun Beam ; Cheon, Tae Hoon ; Seo, Jong Hyun ; Kim, Soo Hyun Elsevier, 2015	552

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