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    <link>https://scholar.dgist.ac.kr/handle/20.500.11750/59105</link>
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    <pubDate>Wed, 10 Jun 2026 00:24:59 GMT</pubDate>
    <dc:date>2026-06-10T00:24:59Z</dc:date>
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      <title>Extreme-Pressure Imprint-Directed Micropatterning of Self-Assembled Nanostructures</title>
      <link>https://scholar.dgist.ac.kr/handle/20.500.11750/60360</link>
      <description>Title: Extreme-Pressure Imprint-Directed Micropatterning of Self-Assembled Nanostructures
Author(s): Kim, Yu Na; Kang, Eun Bin; Kang, Yu Jin; Lee, Junghoon; Hong, Seung Sae; Kim, Sung-Dae; Jeong, Diana; Lee, Min Sun; Park, Woon Ik
Abstract: Extreme pressure imprint lithography (EPIL) offers a simple route to impart microscale geometries without thermal or chemical preconditioning, yet its integration with block copolymer (BCP) self-assembly remains relatively unexplored. Here we report an EPIL-directed micro- and nanopatterning strategy that couples mold-driven microscale confinement with thickness-dependent self-assembly of sphere-forming PS-b-PDMS thin films. When a spin-cast BCP film is imprinted with a rigid Si mold, the imposed height contrast, from a few nanometers on compressed mesas to tens of nanometers inside trenches, governs whether no pattern, monolayer, or double-layer nanostructures appear after thermal annealing and RIE treatment. On ductile Al substrates, simultaneous metal deformation and pressure-driven BCP redistribution create hierarchical patterns, in which polymer accumulation on the raised microfeatures after imprint release leads to selective formation of SiO x nanostructures. This EPIL-directed self-assembly approach provides large-area and shape-versatile patterning enabled by mechanically imposed confinement across rigid and ductile substrates, suggesting a broadly applicable route for hierarchical pattern engineering across multiple length scales.</description>
      <pubDate>Tue, 31 Mar 2026 15:00:00 GMT</pubDate>
      <guid isPermaLink="false">https://scholar.dgist.ac.kr/handle/20.500.11750/60360</guid>
      <dc:date>2026-03-31T15:00:00Z</dc:date>
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