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Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns
- Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns
- Moon, Hyunmin; Kim, Sohee
- DGIST Authors
- Kim, Sohee
- Issue Date
- 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020, 245-248
- This paper proposes a fabrication technique of 3-dimensional (3D) soft and flexible devices with embedded crack-free metal patterns. After the selective bonding between PDMS and parylene-C, additional MEMS techniques such as patterning of conductive lines and pads can be processed on a 2D plane before the transformation into a 3D structure. Moreover, the fabrication processes have been optimized to achieve crack-free metal patterns, because the microcracks in metal patterns could affect the electrical connections and the life-time of soft and flexible devices. Based on the advantageous material characteristics such as flexibility, softness, and biocompatibility, the 3D-structured devices are expected to be used as implantable biomedical devices for various prospective applications. © 2020 IEEE.
- Institute of Electrical and Electronics Engineers Inc.
- Related Researcher
Neural Interfaces & MicroSystems Lab
Neural interface; Brain interface; Bio MEMS; Soft MEMS; Stretchable electronics; Zebrafish electrophysiology
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- Department of Robotics EngineeringNeural Interfaces & MicroSystems Lab2. Conference Papers
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