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Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns

Title
Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns
Authors
Moon, HyunminKim, Sohee
DGIST Authors
Kim, Sohee
Issue Date
2020-01-21
Citation
33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020, 245-248
Type
Conference
ISBN
9781728135809
ISSN
1084-6999
Abstract
This paper proposes a fabrication technique of 3-dimensional (3D) soft and flexible devices with embedded crack-free metal patterns. After the selective bonding between PDMS and parylene-C, additional MEMS techniques such as patterning of conductive lines and pads can be processed on a 2D plane before the transformation into a 3D structure. Moreover, the fabrication processes have been optimized to achieve crack-free metal patterns, because the microcracks in metal patterns could affect the electrical connections and the life-time of soft and flexible devices. Based on the advantageous material characteristics such as flexibility, softness, and biocompatibility, the 3D-structured devices are expected to be used as implantable biomedical devices for various prospective applications. © 2020 IEEE.
URI
http://hdl.handle.net/20.500.11750/11806
DOI
10.1109/MEMS46641.2020.9056341
Publisher
Institute of Electrical and Electronics Engineers Inc.
Related Researcher
  • Author Kim, Sohee Neural Interfaces & MicroSystems Lab
  • Research Interests Neural interface; Brain interface; Bio MEMS; Soft MEMS; Stretchable electronics; Zebrafish electrophysiology
Files:
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Collection:
Department of Robotics EngineeringNeural Interfaces & MicroSystems Lab2. Conference Papers


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