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Issue Date	Title Author(s) Journal	Views
2018	Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process Kim, Bong Hoon; Lee, Jungyup; Won, Sang Min; Xie, Zhaoqian; Chang, Jan-Kai; Yu, Yongjoon; Cho, Youn Kyoung; Jang, Hokyung; Jeong, Ji Yoon; Lee, Yechan; Ryu,Arin; Kim, Do Hoon; Lee, Kun Hyuck; Lee, Jong Yoon; Liu, Fei; Wang, Xueju; Huo, Qingze; Min, Seunghwan; Wu, Di; Ji, Bowen; Banks, Anthony; Kim, Jeonghyun; Oh, Nuri; Jin, Hyeong Min; Han, Seungyong; Kang, Daeshik; Lee, Chi Hwan; Song, Young Min; Zhang, Yihui; Huang, Yonggang; Jang, Kyung-In; Rogers, John A. ACS Nano, 12(5), 4164-4171	199
2018	Mechanically Guided Post-Assembly of 3D Electronic Systems Kim, Bong Hoon; Liu, Fei; Yu, Yongjoon; Jang, Hokyung; Xie, Zhaoqian; Li, Kan; Lee, Jungyup; Jeong, Ji Yoon; Ryu, Arin; Lee, Yechan; Kim, Do Hoon; Wang, Xueju; Lee, Kun Hyuck; Lee, Jong Yoon; Won, Sang Min; Oh, Nuri; Kim, Jeonghyun; Kim, Ju Young; Jeong, Seong-Jun; Jang, Kyung-In; Lee, Seungmin; Huang, Yonggang; Zhang, Yihui; Rogers, John A. Advanced Functional Materials, 28(48), 1-10	191

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