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dc.contributor.advisor Moon, Sang Jun -
dc.contributor.author Lee, Hyun Wook -
dc.date.accessioned 2017-05-10T08:52:43Z -
dc.date.available 2016-02-12T00:00:00Z -
dc.date.issued 2016 -
dc.identifier.uri http://dgist.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002230655 en_US
dc.identifier.uri http://hdl.handle.net/20.500.11750/1458 -
dc.description.abstract At present main issue of neuroscience is to ascertain the relationships between the functional connectivity-map of neuronal circuits and their physiological or pathological func-tions. Voltage clamp are developed for intracellular recording. However, the voltage clamps are limited to measure simultaneous recordings of neural activity from hundreds of individual neu-rons and monitor long-term electrophysiological information. Although Multi-electrode array (MEA) is developed and commercialized to overcome the limits, this two dimensional MEA cannot record intracellular signals. Three dimensional multi-electrode array is suggested to record intracellular signals. In this study, new 3D mushroom shaped MEA is designed. The new MEA has high electrodes density and broad contact area. The MEA is modeled as equiva-lent circuit and simulated to compare with conventional 3D MEA as multisim software. Fabrica-tion conditions of MEA are arranged and problems are analyzed in fabrication process. After this, The MEA would be used to study brain network. ⓒ 2016 DGIST -
dc.description.tableofcontents 1. INTRODUCTION 1--
1.1 Electrophysiological signals 2--
1.2 Methodologies for the recording of neural activity 3--
1.3 Sharp glass electrodes and patch electrodes 4--
1.4 Two dimensional MEA 5--
1.5 Three dimensional MEA 7--
1.5.1 Vertical nanowire electrodes array 8--
1.5.2 3D mushroom shaped MEA 10--
1.6 Electro-plating 13--
1.7 Problem and hypothesis 14--
2. MODELING AND CIRCCUIT ANALYSIS 15--
2.1 Modeling and circuit analysis 15--
3. SIMULATION 19--
3.1 Simulation 19--
4. MATERIALS AND METHODS 22--
4.1 Mushroom shaped 3D MEA fabrication 22--
4.2 Brain Slice preparation 25--
4.2.1 Mouse operation to extract brain 25--
4.2.2 Brain slice using vibratome 27--
4.3 MEA Analysis for brain slice 29--
5. RESULTS AND DISCUSSION 30--
5.1 Simulation results 30--
5.2 Fabrication results 33--
5.2.1 The first mask design(mask_A) 33--
5.2.2 The first photoresist coating and develop 35--
5.2.3 The second mask design(mask_B) 37--
5.2.4 The second photoresist coating and develop 39--
5.2.5 Electroplating results 43--
6. CONCLUSION 46--
6.1 Conclusion 46--
REFERENCES 47
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dc.format.extent 50 -
dc.language eng -
dc.publisher DGIST -
dc.subject Three dimensional multi-electrode array -
dc.subject brain slice -
dc.subject electrical circuit modeling of cell -
dc.subject 3 차원 다채널전극 -
dc.subject 뇌절편 -
dc.subject 세포의 전기회로 모델링 -
dc.title Fabrication of three dimensional mushroom shaped multi-electrode array -
dc.title.alternative 3 차원 버섯 모양의 MEA 제작 -
dc.type Thesis -
dc.identifier.doi 10.22677/thesis.2230655 -
dc.description.alternativeAbstract 현재 신경과학분야에서의 주된 이슈는 신경회로의 생리와 병리상의 기능들 간에 연결 관계를 규명하는 것이다. Voltage clamp가 발명 되면서 단일 세포의 내부신호를 측정할 수 있게 되었다. 하지만 voltage clamp는 많은 수의 뉴런을 오랫동안 관찰하면서 신호를 측정 할 수 없다는 단점을 가지고 있다. 이러한 단점들을 극복하기 위해 2D MEA가 개발되었고 상용화 되었지만, 2D MEA는 내부신호를 측정할 수 없다는 단점을 가지고 있다. 그러므로 각각의 뉴런들이 생성하는 전체적인 전기생리학적 신호들을 확인할 수 있는 이상적인 시스템의 개발이 필요하다. 세포 내부의 전기신호를 측정하는 방법으로 3 차원 형태의 다채널전극이 제안되고 있다. 이번 연구에서는 기존의 3D MEA 보다 높은 전극밀도와 넓은 접촉면적을 가지는 새로운 형태의 3차원 버섯 모양의 다채널전극을 설계하였다. 설계된 3D MEA와 기존의 3D MEA를 모델링 하고 multisim 소프트웨어를 통해 해석하였다. MEMS 기술을 이용하여 설계된 3차원 MEA를 제작하는 과정의 조건들을 정리하였고, 제작과정에서 발생한 문제점을 분석하였다. 향후 3차원 MEA를 뇌절편에 적용하여 뇌조직의 네트워크를 규명하는데 사용할 것이다. ⓒ 2016 DGIST -
dc.description.degree Master -
dc.contributor.department Robotics Engineering -
dc.contributor.coadvisor Moon, Dae Won -
dc.date.awarded 2016. 2 -
dc.publisher.location Daegu -
dc.description.database dCollection -
dc.date.accepted 2016-02-12 -
dc.contributor.alternativeDepartment 대학원 로봇공학전공 -
dc.contributor.affiliatedAuthor Lee, Hyun Wook -
dc.contributor.affiliatedAuthor Moon, Sang Jun -
dc.contributor.affiliatedAuthor Moon, Dae Won -
dc.contributor.alternativeName 이현욱 -
dc.contributor.alternativeName 문상준 -
dc.contributor.alternativeName 문대원 -
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Department of Robotics and Mechatronics Engineering Theses Master

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