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dc.contributor.author Jeong, Heejae -
dc.contributor.author Kim, Y. S. -
dc.contributor.author Baik, Seunghun -
dc.contributor.author Kang, Hongki -
dc.contributor.author Jang, Jae Eun -
dc.contributor.author Kwon, Hyuk-Jun -
dc.date.accessioned 2022-11-09T17:48:10Z -
dc.date.available 2022-11-09T17:48:10Z -
dc.date.created 2022-07-11 -
dc.date.issued 2022-08 -
dc.identifier.issn 0741-3106 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/17090 -
dc.description.abstract To achieve high and uniform phosphorus (P) dopant concentration (more than 1 × 1020 cm-3) near the Germanium (Ge) surface, H2 plasma treatment and modified plasma-assisted delta doping (MPADD) process are proposed and investigated. Sufficient vacancies are formed on the Ge surface using H2 plasma treatment. Consequently, P and vacancies are uniformly included inside during Ge growth through the MPADD process. After the annealing, Phosphorus-vacancy-oxygen (PVO) clusters with the lowest binding energy are formed. Therefore, the migration activation energy increases, and the dopant diffusion into the substrate is reduced. As a result, the surface P dopant concentration (4 × 1021 cm-3) improves, and a uniform P concentration of approximately 5 nm is from the Ge surface. These results show that the MPADD process enables a uniform and high surface doping concentration of recently promising Ge materials and compensates for the disadvantages of conventional delta doping, such as long process time and the need for an ultra-high vacuum system. IEEE -
dc.language English -
dc.publisher Institute of Electrical and Electronics Engineers -
dc.title High and Uniform Phosphorus Doping in Germanium through a Modified Plasma Assisted Delta Doping Process with H2 Plasma Treatment -
dc.type Article -
dc.identifier.doi 10.1109/LED.2022.3182730 -
dc.identifier.scopusid 2-s2.0-85132789972 -
dc.identifier.bibliographicCitation IEEE Electron Device Letters, v.43, no.8, pp.1315 - 1318 -
dc.description.isOpenAccess FALSE -
dc.subject.keywordAuthor Annealing -
dc.subject.keywordAuthor Doping profiles -
dc.subject.keywordAuthor Germanium -
dc.subject.keywordAuthor germanium -
dc.subject.keywordAuthor H2 plasma treatment -
dc.subject.keywordAuthor Modified plasma-assisted delta doping -
dc.subject.keywordAuthor phosphorus -
dc.subject.keywordAuthor Plasma temperature -
dc.subject.keywordAuthor Plasmas -
dc.subject.keywordAuthor Substrates -
dc.subject.keywordAuthor Surface treatment -
dc.subject.keywordPlus N-TYPE -
dc.subject.keywordPlus ION-IMPLANTATION -
dc.subject.keywordPlus DIFFUSION -
dc.subject.keywordPlus SILICON -
dc.subject.keywordPlus ACTIVATION -
dc.subject.keywordPlus DEVICES -
dc.subject.keywordPlus GE -
dc.citation.endPage 1318 -
dc.citation.number 8 -
dc.citation.startPage 1315 -
dc.citation.title IEEE Electron Device Letters -
dc.citation.volume 43 -
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Department of Electrical Engineering and Computer Science Advanced Electronic Devices Research Group(AEDRG) - Kang Lab. 1. Journal Articles

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