Cited 2 time in
Cited 2 time in
Design and fabrication of a vibration sensor using a conductive ball
- Design and fabrication of a vibration sensor using a conductive ball
- Cho, YS[Cho, Yong-Soo]; Jang, SW[Jang, Sung-Wook]; Sohn, YS[Sohn, Young-Soo]; Choi, SY[Choi, Sie-Young]
- DGIST Authors
- Sohn, YS[Sohn, Young-Soo]
- Issue Date
- Microelectronics Journal, 38(3), 416-421
- Article Type
- Anisotropy; Conductive Ball; Convex Corner Rounding; Encapsulation; MEMS; Metallic Films; Micromachining; Sensors; Vibration Measurement; Vibration Sensor; Vibration Sensors
- We have fabricated a MEMS-based vibration sensor with a conductive ball. The vibration sensor consisted of a conductive ball placed in a 600 μm deep anisotropically micromachined silicon cavity, two electrodes on the non-planar surface, and a cover glass for encapsulation. Before Au film deposition, the sharp convex corner at the upper edge of the cavity was rounded to deposit the metal film without disconnecting on the non-planar surface. The shadow-mask technique allowed for the simultaneous metal deposition and patterning on three-dimensional structures without the conventional photolithography. The frequency responses of the proposed MEMS-based vibration sensor using a conductive ball ranging from 0 to 30 Hz were stable. © 2007 Elsevier Ltd. All rights reserved.
- Elsevier Ltd.
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- School of Undergraduate Studies1. Journal Articles
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