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dc.contributor.author Jeong, Kyeongwon -
dc.contributor.author Choi, Jaesuk -
dc.contributor.author Yun, Gichan -
dc.contributor.author Choi, Injun -
dc.contributor.author Son, Jeehoon -
dc.contributor.author Hwang, Jae Youn -
dc.contributor.author Ha, Sohmyung -
dc.contributor.author Je, Minkyu -
dc.date.accessioned 2024-01-19T00:10:51Z -
dc.date.available 2024-01-19T00:10:51Z -
dc.date.created 2023-02-02 -
dc.date.issued 2022-11-09 -
dc.identifier.isbn 9781665471435 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/47629 -
dc.description.abstract Biomedical applications of ultrasound (US) imaging have been extended and diversified. Some recent applications, such as intracardiac echocardiography [1], [2] and the intravascular US [3], require extreme miniaturization of the US imaging system. As another promising application, an ultrasound capsule endoscopy (USCE) is being developed to provide transmural scans of the gastrointestinal tract and enable the detection of deeper pathology [4]. However, the USCE has only been studied by focusing on the transducer array, and ASIC research for US imaging in capsule endoscopy has not been conducted. Moreover, the USCE imposes stringent restrictions on not only the system size but also the power consumption because the imaging system should operate for long hours with tiny batteries (Fig. 1). In our work, an on-chip US transmitter (TX) and a highly power-efficient US receiver (RX) IC for USCE application are proposed. Instead of using a power-hungry high-speed ADC to acquire the US signal at a high center frequency (f-textcenter), we propose a new RX structure employing synchronized analog envelop detection (ED) to reduce the required ADC speed. A noise-shaping SAR (NS-SAR) ADC is used to improve power efficiency further while providing high resolution. © 2022 IEEE. -
dc.language English -
dc.publisher IEEE Solid-State Circuits Society -
dc.title A 20-MHz 2.3-mW Receiver and a 25-V Transmitter for Ultrasound Capsule Endoscopy -
dc.type Conference Paper -
dc.identifier.doi 10.1109/A-SSCC56115.2022.9980696 -
dc.identifier.scopusid 2-s2.0-85146611576 -
dc.identifier.bibliographicCitation IEEE Asian Solid-State Circuits Conference, pp.1 - 3 -
dc.citation.conferencePlace CH -
dc.citation.conferencePlace Taipei -
dc.citation.endPage 3 -
dc.citation.startPage 1 -
dc.citation.title IEEE Asian Solid-State Circuits Conference -
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Department of Electrical Engineering and Computer Science MBIS(Multimodal Biomedical Imaging and System) Laboratory 2. Conference Papers

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