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A Monolithically Integrated Pressure/Oxygen/Temperature Sensing SoC for Multimodality Intracranial Neuromonitoring

Title
A Monolithically Integrated Pressure/Oxygen/Temperature Sensing SoC for Multimodality Intracranial Neuromonitoring
Authors
Chan, Wai PanNarducci, MargaritaGao, YuanCheng, Ming-YuanCheong, Jia HaoGeorge, Arup K.Cheam, Daw DonLeong, Siew ChongDamalerio, Maria Ramona B.Lim, RuiqiTsai, Ming-LingRahman, Abdur R. A.Park, Mi KyoungKong, Zhi HuiPrashanth, Rao JaiJe, Minkyu
DGIST Authors
Je, Minkyu
Issue Date
2014-11
Citation
IEEE Journal of Solid: State Circuits, 49(11), 2449-2461
Type
Article
Article Type
Article; Proceedings Paper
Keywords
Capacitance-to-Voltage Converter (CVC)Capacitance-to-Voltage ConvertersCapacitive Pressure SensorCapacitive Pressure SensorsElectrochemical OxygenElectrochemical Oxygen SensorIntracranial PressureIntracranial Pressure (ICP)Temperature SensorTemperature SensorsTraumatic Brain InjuriesTraumatic Brain Injury (TBI)
ISSN
0018-9200
Abstract
A fully integrated SoC for multimodality intracranial neuromonitoring is presented in this paper. Three sensors including a capacitive MEMS pressure sensor, an electrochemical oxygen sensor and a solid-state temperature sensor are integrated together in a single chip with their respective interface circuits. Chopper stabilization and dynamic element matching techniques are applied in sensor interface circuits to reduce circuit noise and offset. On-chip calibration is implemented for each sensor to compensate process variations. Measured sensitivity of the pressure, oxygen, and temperature sensors are 18.6 aF/mmHg, 194 pA/mmHg, and 2 mV/°C, respectively. Implemented in 0.18 μm CMOS, the SoC occupies an area of 1.4 mm × 4 mm and consumes 166 μW DC power. A prototype catheter for intracranial pressure (ICP) monitoring has been implemented and the performance has been verified with ex vivo experiment. © 1966-2012 IEEE.
URI
http://hdl.handle.net/20.500.11750/2638
DOI
10.1109/JSSC.2014.2345754
Publisher
Institute of Electrical and Electronics Engineers Inc.
Files:
There are no files associated with this item.
Collection:
Information and Communication EngineeringETC1. Journal Articles


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