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Issue Date Title Author(s) Journal View
2014-07-01
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect

Mun, Ki-Yeung ;  Hong, Tae Eun ;  Cheon, Taehoon ;  Jang, Yujin ;  Lim, Byoung-Yong ;  Kim, Sunjung ;  Kim, Soo-Hyun

Thin Solid Films, v.562, pp.118 - 125, 2014-07-01

 498
2014-10-15
Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition

Park, Ji-Yoon ;  Yeo, Seungmin ;  Cheon, Taehoon ;  Kim, Soo-Hyun ;  Kim, Min-Kyu ;  Kim, Hyungjun ;  Hong, Tae Eun ;  Lee, Do-Joong

Journal of Alloys and Compounds, v.610, pp.529 - 539, 2014-10-15

 594
2019-11
Thickness-dependent electrochemical response of plasma enhanced atomic layer deposited WS2 anodes in Na-ion battery

Nandi, Dip K. ;  Yeo, Seungmin ;  Ansari, Mohd Zahid ;  Sinha, Soumyadeep ;  Cheon, Taehoon ;  Kwon, Jiseok ;  Kim, Hyungjun ;  Heo, Jaeyeong ;  Song, Taeseup ;  Kim, Soo-Hyun

Elsevier Ltd, 2019-11

 556
2019-05
Atomic-Layer-Deposited MoN x Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction

Ramesh, Rahul ;  Nandi, Dip K. ;  Kim, Tae Hyun ;  Cheon, Taehoon ;  Oh, Jihun ;  Kim, Soo-Hyun

American Chemical Society, 2019-05

 549
2013-11
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization

Yeo, Seungmin ;  Choi, Sang-Hyeok ;  Park, Ji-Yoon ;  Kim, Soo-Hyun ;  Cheon, Taehoon ;  Lim, Byoung-Yong ;  Kim, Sunjung

Elsevier BV, 2013-11

 592
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