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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 2 of 2

Article
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
  • Kim, Kiwan ; 
  • Kong, Daeyoung ; 
  • Kim, Yunseo ; 
  • Jang, Bongho ; 
  • Cho, Jungwan ; 
  • Kwon, Hyuk-Jun ; 
  • Lee, Hyoungsoon
  • 2024-03
  • Kim, Kiwan. (2024-03). Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap. Applied Thermal Engineering, 241. doi: 10.1016/j.applthermaleng.2023.122325
  • Elsevier
  • View : 431
  • Download : 0
Article
Thermally induced structural evolution of diamond surface for pool boiling enhancement
  • Kim, Yunseo ; 
  • Kong, Daeyoung ; 
  • Park, Jeonghwan ; 
  • Jang, Bongho ; 
  • Kim, Taeyeon ; 
  • Kwon, Hyuk-Jun ; 
  • Cho, Jungwan ; 
  • Bin In, Jung ; 
  • Lee, Hyoungsoon
  • 2026-03
  • APPLIED THERMAL ENGINEERING, v.289
  • PERGAMON-ELSEVIER SCIENCE LTD
  • View : 2
  • Download : 0
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