Showing results 1 to 2 of 2
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Shin, Kwonsik
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Kim, Dongsu
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Park, Hyunchul
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Sim, Minkyung
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Jang, Hyunwoo
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Sohn, Jung Inn
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Cha, Seung Nam
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Jang, Jae Eun
- 2020-01
- Shin, Kwonsik. (2020-01). Artificial Tactile Sensor with Pin-type Module for Depth Profile and Surface Topography Detection. IEEE Transactions on Industrial Electronics, 67(1), 637–646. doi: 10.1109/TIE.2019.2912788
- Institute of Electrical and Electronics Engineers
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Park, Chaehyun
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Kweon, Minjeong
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Mohapatra, Debananda
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Cheon, Taehoon
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Bae, Jong-Seong
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Jeong, Daeyoon
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Jang, Hyunwoo
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Shim, Seungwon
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Park, Young-Bae
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Kang, Youngho
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et al
- 2025-06
- Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
- American Chemical Society
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