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  • Lee, Byungchan ; 
  • Shim, Seungwon ; 
  • Trinh, Ngoc Le ; 
  • Patil, Aravind H. ; 
  • Nguyen, Chi Thang ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun ; 
  • Kang, Youngho ; 
  • Lee, Han-Bo-Ram
  • 2025-09
  • Journal of Materials Chemistry C, v.13, no.37, pp.19316 - 19329
  • Royal Society of Chemistry
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  • Park, Chaehyun ; 
  • Kweon, Minjeong ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Bae, Jong-Seong ; 
  • Jeong, Daeyoon ; 
  • Jang, Hyunwoo ; 
  • Shim, Seungwon ; 
  • Park, Young-Bae ; 
  • Kang, Youngho ; 
  • et al
  • 2025-06
  • Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
  • American Chemical Society
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