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  • HyunKi, Ryu
  • Cho, SungRae
  • Jon, YongJun
  • Kim, Bonghwan
  • Kim, Dongkyun
  • 2026-05
  • JOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY, v.21, no.3, pp.3139 - 3161
  • SPRINGER SINGAPORE PTE LTD
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  • Kim, Sangwon
  • Lee, Junman
  • Nam, Jaewoo
  • Kim, Bonghwan
  • Cho, Chanseob
  • Kim, Jung Yup
  • Choi, Hongsoo
  • 2014-07
  • Kim, Sangwon. (2014-07). Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package. doi: 10.1007/s12206-014-0634-0
  • Korean Society of Mechanical Engineers
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  • Son, Byungrak
  • Cho, Changhak
  • Son, Sujin
  • Seul, Jin-hyun
  • Jon, Yong Jun
  • Kim, Bonghwan
  • Byun, Taeyoung
  • 2025-01-21
  • 13th International Conference on Ubi-Media Computing, Ubi-Media 2025, pp.101 - 110
  • Kasersar University
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