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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
  • Kim, Kiwan ; 
  • Kong, Daeyoung ; 
  • Kim, Yunseo ; 
  • Jang, Bongho ; 
  • Cho, Jungwan ; 
  • Kwon, Hyuk-Jun ; 
  • Lee, Hyoungsoon
  • 2024-03
  • Kim, Kiwan. (2024-03). Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap. Applied Thermal Engineering, 241. doi: 10.1016/j.applthermaleng.2023.122325
  • Elsevier
  • View : 364
  • Download : 0
Article
Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
  • Kong, Daeyoung ; 
  • Kwon, Heungdong ; 
  • Jang, Bongho ; 
  • Kwon, Hyuk-Jun ; 
  • Asheghi, Mehdi ; 
  • Goodson, Kenneth E. ; 
  • Lee, Hyoungsoon
  • 2024-09
  • Kong, Daeyoung. (2024-09). Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels. Energy Conversion and Management, 315. doi: 10.1016/j.enconman.2024.118809
  • Elsevier
  • View : 192
  • Download : 0
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