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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 8 of 8

Article
Advanced Atomic Layer Modulation Based Highly Homogeneous PtRu Precious Metals Alloy Thin Films
  • Son, Yeseul ; 
  • Kim, Sang Bok ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun
  • 2025-08
  • Advanced Science, v.12, no.29
  • Wiley
  • View : 180
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Conference
Atomic Layer Deposited Highly Conductive Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects
  • Park, Chaehyun ; 
  • Kweon, Minjeong ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Bae, Jong-Seong ; 
  • Jeong, Daeyoon ; 
  • Park, Young-Bae ; 
  • Kim, Soo-Hyun
  • 2025-06-03
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
  • View : 108
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Article
Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition
  • Park, Chaehyun ; 
  • Kweon, Minjeong ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Bae, Jong-Seong ; 
  • Jeong, Daeyoon ; 
  • Jang, Hyunwoo ; 
  • Shim, Seungwon ; 
  • Park, Young-Bae ; 
  • Kang, Youngho ; 
    • et al
  • 2025-06
  • Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
  • American Chemical Society
  • View : 1226
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Conference
Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects
  • Kim, Jeongha ; 
  • Mohapatra, Debananda ; 
  • Son, Yeseul ; 
  • Jang, Jae Min ; 
  • Kim, Sang Bok ; 
  • Cheon, Taehoon ; 
  • Shong, Boggeun ; 
  • Kim, Soo-Hyun
  • 2025-06-04
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
  • View : 93
  • Download : 0
Article
Layer Engineered MXene Empowered Wearable Pressure Sensors for Non-Invasive Vital Human–Machine Interfacing Healthcare Monitoring
  • Mohapatra, Debananda ; 
  • Byun, Jeong Eun ; 
  • Ansari, Mohd Zahid ; 
  • Kim, Haekyoung ; 
  • Cheon, Taehoon ; 
  • Jang, Jongmoon ; 
  • Cho, Young-Rae ; 
  • Lee, Jung Woo ; 
  • Kim, Soo-Hyun
  • 2023-12
  • Mohapatra, Debananda. (2023-12). Layer Engineered MXene Empowered Wearable Pressure Sensors for Non-Invasive Vital Human–Machine Interfacing Healthcare Monitoring. Advanced Materials Technologies, 8(24). doi: 10.1002/admt.202301175
  • Wiley
  • View : 165
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Conference
Plasma-Enhanced Atomic Layer Deposition of Yttrium Carbide Thin Films as a Promising Transition Metal Carbide for Dual Diffusion Barrier in Cu and Ru Metallization
  • Kweon, Minjeong ; 
  • Park, Chaehyun ; 
  • Mohapatra, Debananda ; 
  • Kim, Sang Bok ; 
  • Bae, Jong-Seong ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun
  • 2025-06-04
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
  • View : 91
  • Download : 0

Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring

Article
Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring
  • Mohapatra, Debananda ; 
  • Shin, Yujin ; 
  • Ansari, Mohd Zahid ; 
  • Kim, Youn-Hye ; 
  • Park, Ye Jin ; 
  • Cheon, Taehoon ; 
  • Kim, Haekyoung ; 
  • Lee, Jung Woo ; 
  • Kim, Soo-Hyun
  • 2023-04
  • Mohapatra, Debananda. (2023-04). Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring. Advanced Science, 10(12). doi: 10.1002/advs.202206355
  • John Wiley and Sons Inc
  • View : 224
  • Download : 95
Article
Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization
  • Kweon, Minjeong ; 
  • Park, Chaehyun ; 
  • Mohapatra, Debananda ; 
  • Kim, Sang Bok ; 
  • Bae, Jong-Seong ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun
  • 2025-08
  • Kweon, Minjeong. (2025-08). Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization. Applied Surface Science, 701. doi: 10.1016/j.apsusc.2025.163302
  • Elsevier
  • View : 141
  • Download : 0
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