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Showing results 1 to 7 of 7

Conference
Atomic Layer Deposited Highly Conductive Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects
  • Park, Chaehyun ; 
  • Kweon, Minjeong ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Bae, Jong-Seong ; 
  • Jeong, Daeyoon ; 
  • Park, Young-Bae ; 
  • Kim, Soo-Hyun
  • 2025-06-03
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
  • View : 23
  • Download : 0
Article
Enhanced performance of solution-processed organic light-emitting diodes with TEMPOL derivatives
  • Kim, Jae Ho ; 
  • Oh, Sumin ; 
  • Park, Chaehyun ; 
  • Kim, Yubin ; 
  • Lim, Gyumok ; 
  • Lee, Youngu ; 
  • Choi, Jin Woo ; 
  • Lee, Hyung Woo ; 
  • Song, Myungkwan
  • 2025-04
  • Synthetic Metals, v.311
  • Elsevier
  • View : 175
  • Download : 0
Article
Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition
  • Park, Chaehyun ; 
  • Kweon, Minjeong ; 
  • Mohapatra, Debananda ; 
  • Cheon, Taehoon ; 
  • Bae, Jong-Seong ; 
  • Jeong, Daeyoon ; 
  • Jang, Hyunwoo ; 
  • Shim, Seungwon ; 
  • Park, Young-Bae ; 
  • Kang, Youngho ; 
    • et al
  • 2025-06
  • Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
  • American Chemical Society
  • View : 1094
  • Download : 0
Article
Low-Temperature Cross-Linkable Hole Transport Materials for Solution-Processed Quantum Dot and Organic Light-Emitting Diodes with High Efficiency and Color Purity
  • Maheshwaran, Athithan ; 
  • Bae, Hyejeong ; 
  • Park, Jaehyoung ; 
  • Jung, Hyeonwoo ; 
  • Hwang, Youngjun ; 
  • Kim, Jongyoun ; 
  • Park, Chaehyun ; 
  • Kang, Byeongjae ; 
  • Song, Myungkwan ; 
  • Lee, Youngu
  • 2023-09
  • Maheshwaran, Athithan. (2023-09). Low-Temperature Cross-Linkable Hole Transport Materials for Solution-Processed Quantum Dot and Organic Light-Emitting Diodes with High Efficiency and Color Purity. ACS Applied Materials & Interfaces, 15(38), 45167–45176. doi: 10.1021/acsami.3c09106
  • American Chemical Society
  • View : 206
  • Download : 0
Article
New class of Zr precursor containing boratabenzene ligand enabling highly conformal wafer-scale zirconium dioxide thin films through atomic layer deposition
  • Ansari, Mohd Zahid ; 
  • Janicek, Petr ; 
  • Namgung, Sook ; 
  • Kim, Hyangil ; 
  • Nandi, Dip K. ; 
  • Cheon, Taehoon ; 
  • Siddiqui, Masoom Raza ; 
  • Imran, Muhammad ; 
  • Jang, Yujin ; 
  • Bae, Jong-Seong ; 
    • et al
  • 2024-03
  • Ansari, Mohd Zahid. (2024-03). New class of Zr precursor containing boratabenzene ligand enabling highly conformal wafer-scale zirconium dioxide thin films through atomic layer deposition. Surfaces and Interfaces, 46. doi: 10.1016/j.surfin.2024.104014
  • Elsevier
  • View : 309
  • Download : 0
Conference
Plasma-Enhanced Atomic Layer Deposition of Yttrium Carbide Thin Films as a Promising Transition Metal Carbide for Dual Diffusion Barrier in Cu and Ru Metallization
  • Kweon, Minjeong ; 
  • Park, Chaehyun ; 
  • Mohapatra, Debananda ; 
  • Kim, Sang Bok ; 
  • Bae, Jong-Seong ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun
  • 2025-06-04
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
  • View : 20
  • Download : 0
Article
Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization
  • Kweon, Minjeong ; 
  • Park, Chaehyun ; 
  • Mohapatra, Debananda ; 
  • Kim, Sang Bok ; 
  • Bae, Jong-Seong ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun
  • 2025-08
  • Kweon, Minjeong. (2025-08). Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization. Applied Surface Science, 701. doi: 10.1016/j.apsusc.2025.163302
  • Elsevier
  • View : 85
  • Download : 0
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