Showing results 1 to 5 of 5
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Kim, Jae Ho
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Oh, Sumin
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Park, Chaehyun
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Kim, Yubin
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Lim, Gyumok
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Lee, Youngu
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Choi, Jin Woo
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Lee, Hyung Woo
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Song, Myungkwan
- 2025-04
- Kim, Jae Ho. (2025-04). Enhanced performance of solution-processed organic light-emitting diodes with TEMPOL derivatives. Synthetic Metals, 311. doi: 10.1016/j.synthmet.2024.117798
- Elsevier
- View : 144
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Park, Chaehyun
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Kweon, Minjeong
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Mohapatra, Debananda
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Cheon, Taehoon
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Bae, Jong-Seong
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Jeong, Daeyoon
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Jang, Hyunwoo
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Shim, Seungwon
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Park, Young-Bae
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Kang, Youngho
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et al
- 2025-06
- Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
- American Chemical Society
- View : 1061
- Download : 0
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Maheshwaran, Athithan
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Bae, Hyejeong
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Park, Jaehyoung
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Jung, Hyeonwoo
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Hwang, Youngjun
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Kim, Jongyoun
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Park, Chaehyun
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Kang, Byeongjae
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Song, Myungkwan
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Lee, Youngu
- 2023-09
- Maheshwaran, Athithan. (2023-09). Low-Temperature Cross-Linkable Hole Transport Materials for Solution-Processed Quantum Dot and Organic Light-Emitting Diodes with High Efficiency and Color Purity. ACS Applied Materials & Interfaces, 15(38), 45167–45176. doi: 10.1021/acsami.3c09106
- American Chemical Society
- View : 178
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Ansari, Mohd Zahid
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Janicek, Petr
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Namgung, Sook
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Kim, Hyangil
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Nandi, Dip K.
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Cheon, Taehoon
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Siddiqui, Masoom Raza
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Imran, Muhammad
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Jang, Yujin
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Bae, Jong-Seong
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et al
- 2024-03
- Ansari, Mohd Zahid. (2024-03). New class of Zr precursor containing boratabenzene ligand enabling highly conformal wafer-scale zirconium dioxide thin films through atomic layer deposition. Surfaces and Interfaces, 46. doi: 10.1016/j.surfin.2024.104014
- Elsevier
- View : 287
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Kweon, Minjeong
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Park, Chaehyun
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Mohapatra, Debananda
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Kim, Sang Bok
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Bae, Jong-Seong
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Cheon, Taehoon
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Kim, Soo-Hyun
- 2025-08
- Kweon, Minjeong. (2025-08). Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization. Applied Surface Science, 701. doi: 10.1016/j.apsusc.2025.163302
- Elsevier
- View : 60
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