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Conference
Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects
  • Kim, Jeongha ; 
  • Mohapatra, Debananda ; 
  • Son, Yeseul ; 
  • Jang, Jae Min ; 
  • Kim, Sang Bok ; 
  • Cheon, Taehoon ; 
  • Shong, Boggeun ; 
  • Kim, Soo-Hyun
  • 2025-06-04
  • International Interconnect Technology Conference, IITC 2025, pp.1 - 3
  • Korean Institute of Electrical and Electronic Material Engineers(한국전기전자재료학회)
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