DGIST Library Repository

Browsing by Titles

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 3 of 3

Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1045
  • Download : 0
Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1125
  • Download : 0
Article
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
  • Mun, Ki-Yeung ; 
  • Hong, Tae Eun ; 
  • Cheon, Taehoon ; 
  • Jang, Yujin ; 
  • Lim, Byoung-Yong ; 
  • Kim, Sunjung ; 
  • Kim, Soo-Hyun
  • 2014-07-01
  • Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
  • Elsevier
  • View : 711
  • Download : 0
1