Showing results 1 to 4 of 4
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Kim, Sangwon
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Lee, Junman
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Nam, Jaewoo
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Kim, Bonghwan
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Cho, Chanseob
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Kim, Jung Yup
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Choi, Hongsoo
- 2014-07
- Kim, Sangwon. (2014-07). Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package. doi: 10.1007/s12206-014-0634-0
- Korean Society of Mechanical Engineers
- View : 918
- Download : 0
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Park, Byung Nam
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Shon, Yeong Soo
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Choi, Sie Young
- 2008-02
- Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
- Elsevier BV
- View : 1045
- Download : 0
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Park, Byung Nam
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Shon, Yeong Soo
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Choi, Sie Young
- 2008-02
- Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
- Elsevier BV
- View : 1125
- Download : 0
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Jeong, Wooseong
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Lee, Seonmin
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Choi, Hyeokjoo
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Bae, Jihoon
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Lee, Seon-Hak
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Ma, Yoohan
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Yoo, Seungsun
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Ha, Jae-Hyun
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Hong, Jung-Il
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Park, Seoyeon
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et al
- 2022-12
- Jeong, Wooseong. (2022-12). Washable, stretchable, and reusable core–shell metal nanowire network-based electronics on a breathable polymer nanomesh substrate. Materials Today, 61, 30–39. doi: 10.1016/j.mattod.2022.10.023
- Elsevier BV
- View : 382
- Download : 0
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