Browsing by Titles

Showing results 1 to 4 of 4

  • Kim, Sangwon
  • Lee, Junman
  • Nam, Jaewoo
  • Kim, Bonghwan
  • Cho, Chanseob
  • Kim, Jung Yup
  • Choi, Hongsoo
  • 2014-07
  • Kim, Sangwon. (2014-07). Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package. doi: 10.1007/s12206-014-0634-0
  • Korean Society of Mechanical Engineers
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  • Park, Byung Nam
  • Shon, Yeong Soo
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1045
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  • Park, Byung Nam
  • Shon, Yeong Soo
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1125
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  • Jeong, Wooseong
  • Lee, Seonmin
  • Choi, Hyeokjoo
  • Bae, Jihoon
  • Lee, Seon-Hak
  • Ma, Yoohan
  • Yoo, Seungsun
  • Ha, Jae-Hyun
  • Hong, Jung-Il
  • Park, Seoyeon
  • et al
  • 2022-12
  • Jeong, Wooseong. (2022-12). Washable, stretchable, and reusable core–shell metal nanowire network-based electronics on a breathable polymer nanomesh substrate. Materials Today, 61, 30–39. doi: 10.1016/j.mattod.2022.10.023
  • Elsevier BV
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