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Showing results 1 to 4 of 4

Article
Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
  • Kim, Sangwon ; 
  • Lee, Junman ; 
  • Nam, Jaewoo ; 
  • Kim, Bonghwan ; 
  • Cho, Chanseob ; 
  • Kim, Jung Yup ; 
  • Choi, Hongsoo
  • 2014-07
  • Kim, Sangwon. (2014-07). Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package. doi: 10.1007/s12206-014-0634-0
  • Korean Society of Mechanical Engineers
  • View : 957
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Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1071
  • Download : 0
Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1150
  • Download : 0
Article
Washable, stretchable, and reusable core–shell metal nanowire network-based electronics on breathable polymer nanomesh substrate
  • Jeong, Wooseong ; 
  • Lee, Seonmin ; 
  • Choi, Hyeokjoo ; 
  • Bae, Jihoon ; 
  • Lee, Seon-Hak ; 
  • Ma, Yoohan ; 
  • Yoo, Seungsun ; 
  • Ha, Jae-Hyun ; 
  • Hong, Jung-Il ; 
  • Park, Seoyeon ; 
    • et al
  • 2022-12
  • Materials Today, v.61, pp.30 - 39
  • Elsevier BV
  • View : 423
  • Download : 0
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