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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
  • Choi, Sang Kyung ; 
  • Kim, Han Gil ; 
  • Kim, Jun Beam ; 
  • Cheon, Tae Hoon ; 
  • Seo, Jong Hyun ; 
  • Kim, Soo Hyun
  • 2015
  • Choi, Sang Kyung. (2015). Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization. doi: 10.1016/j.tsf.2015.05.033
  • Elsevier
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