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Showing results 1 to 4 of 4

Issue Date	Title Author(s) Journal	View
2012-10	A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects Eom, Tae-Kwang ; Sari, Windu ; Cheon, Taehoon ; Kim, Soo-Hyun ; Kim, Woo Kyoung Elsevier BV, 2012-10	651
2013-01	Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2 Hong, Tae Eun ; Choi, Sang-Hyeok ; Yeo, Seungmin ; Park, Ji-Yoon ; Kim, Soo-Hyun ; Cheon, Taehoon ; Kim, Hoon ; Kim, Min-Kyu ; Kim, Hyungjun ECS Journal of Solid State Science and Technology, v.2, no.3, pp.P47 - P53, 2013-01	429
2022-09	Development of RuS2 for near-infrared photodetector by atomic layer deposition and post-sulfurization Nakazawa, Tatsuya ; Kim, Donghyun ; Kim, Jaehyeok ; Kotsugi, Yohei ; Cheon, Taehoon ; Chung, Seung-Min ; Kim, Soo-Hyun ; Kim, Hyungjun Rare Metals, v.41, no.9, pp.3086 - 3099, 2022-09	108
2014-07-01	The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect Mun, Ki-Yeung ; Hong, Tae Eun ; Cheon, Taehoon ; Jang, Yujin ; Lim, Byoung-Yong ; Kim, Sunjung ; Kim, Soo-Hyun Thin Solid Films, v.562, pp.118 - 125, 2014-07-01	498

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