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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun ; 
  • Kim, Woo Kyoung
  • 2012-10
  • Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
  • Elsevier BV
  • View : 879
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Article
Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2
  • Hong, Tae Eun ; 
  • Choi, Sang-Hyeok ; 
  • Yeo, Seungmin ; 
  • Park, Ji-Yoon ; 
  • Kim, Soo-Hyun ; 
  • Cheon, Taehoon ; 
  • Kim, Hoon ; 
  • Kim, Min-Kyu ; 
  • Kim, Hyungjun
  • 2013-01
  • Hong, Tae Eun. (2013-01). Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2. ECS Journal of Solid State Science and Technology, 2(3), P47–P53. doi: 10.1149/2.001303jss
  • Electrochemical Society, Inc.
  • View : 579
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Article
Development of RuS2 for near-infrared photodetector by atomic layer deposition and post-sulfurization
  • Nakazawa, Tatsuya ; 
  • Kim, Donghyun ; 
  • Kim, Jaehyeok ; 
  • Kotsugi, Yohei ; 
  • Cheon, Taehoon ; 
  • Chung, Seung-Min ; 
  • Kim, Soo-Hyun ; 
  • Kim, Hyungjun
  • 2022-09
  • Nakazawa, Tatsuya. (2022-09). Development of RuS2 for near-infrared photodetector by atomic layer deposition and post-sulfurization. Rare Metals, 41(9), 3086–3099. doi: 10.1007/s12598-022-02012-2
  • University of Science and Technology Beijing
  • View : 336
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Article
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
  • Mun, Ki-Yeung ; 
  • Hong, Tae Eun ; 
  • Cheon, Taehoon ; 
  • Jang, Yujin ; 
  • Lim, Byoung-Yong ; 
  • Kim, Sunjung ; 
  • Kim, Soo-Hyun
  • 2014-07-01
  • Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
  • Elsevier
  • View : 710
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