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Cobalt titanium nitride amorphous metal alloys by atomic layer deposition
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dc.contributor.author Nam, Taewook -
dc.contributor.author Lee, Chang Wan -
dc.contributor.author Cheon, Taehoon -
dc.contributor.author Lee, Woo Jae -
dc.contributor.author Kim, Soo-Hyun -
dc.contributor.author Kwon, Se-Hun -
dc.contributor.author Lee, Han-Bo-Ram -
dc.contributor.author Kim, Hyungjun -
dc.date.accessioned 2021-07-20T20:04:29Z -
dc.date.available 2021-07-20T20:04:29Z -
dc.date.created 2020-07-30 -
dc.date.issued 2018-03 -
dc.identifier.issn 0925-8388 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/13874 -
dc.description.abstract The formation of thin amorphous cobalt titanium nitride (CoTiN) layers was investigated using a supercycle method of atomic layer deposition (ALD). The stoichiometry of the resultant ALD CoTiN films was controlled by changing the ratio of Co and TiN thicknesses. X-ray diffraction analysis and transmission electron microscopy observations showed that the microstructure of the ALD Co and TiN was transformed from polycrystalline to amorphous CoTiN. The stoichiometry of the CoTiN layer was affected by the growth characteristics of ALD Co and TiN on each surface. The results revealed that ALD TiN undergoes nucleation incubation on the ALD Co surface, whereas ALD Co does not undergo nucleation incubation on the ALD TiN surface. The properties of the amorphous CoTiN layers were evaluated by diffusion experiments and mechanical tests. Because of the lack of grain boundaries, the CoTiN efficiently blocks the diffusion of Cu at elevated temperatures and exhibits higher hardness compared with ALD Co. (c) 2017 Elsevier B.V. All rights reserved. -
dc.language English -
dc.publisher Elsevier BV -
dc.title Cobalt titanium nitride amorphous metal alloys by atomic layer deposition -
dc.type Article -
dc.identifier.doi 10.1016/j.jallcom.2017.12.023 -
dc.identifier.scopusid 2-s2.0-85038250197 -
dc.identifier.bibliographicCitation Nam, Taewook. (2018-03). Cobalt titanium nitride amorphous metal alloys by atomic layer deposition. Journal of Alloys and Compounds, 737, 684–692. doi: 10.1016/j.jallcom.2017.12.023 -
dc.description.isOpenAccess FALSE -
dc.subject.keywordAuthor Amorphous metal alloy -
dc.subject.keywordAuthor Metal-metal nitride alloy -
dc.subject.keywordAuthor CoTiN -
dc.subject.keywordAuthor Atomic layer deposition -
dc.subject.keywordAuthor Interlayer formation -
dc.subject.keywordAuthor Diffusion barrier -
dc.subject.keywordPlus TIN THIN-FILMS -
dc.subject.keywordPlus DIFFUSION-BARRIERS -
dc.subject.keywordPlus CU METALLIZATION -
dc.subject.keywordPlus BIS(N-TERT-BUTYL-N'-ETHYLPROPIONAMIDINATO) COBALT(II) -
dc.subject.keywordPlus MECHANICAL-PROPERTIES -
dc.subject.keywordPlus GROWTH-RATE -
dc.subject.keywordPlus COPPER -
dc.subject.keywordPlus NANOINDENTATION -
dc.subject.keywordPlus PHASE -
dc.subject.keywordPlus TA -
dc.citation.endPage 692 -
dc.citation.startPage 684 -
dc.citation.title Journal of Alloys and Compounds -
dc.citation.volume 737 -
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