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In Situ Formation of Ag Nanoparticles for Fiber Strain Sensors: Toward Textile-Based Wearable Applications
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Title
In Situ Formation of Ag Nanoparticles for Fiber Strain Sensors: Toward Textile-Based Wearable Applications
Issued Date
2021-08
Citation
Kim, Hwajoong. (2021-08). In Situ Formation of Ag Nanoparticles for Fiber Strain Sensors: Toward Textile-Based Wearable Applications. ACS Applied Materials & Interfaces, 13(33), 39868–39879. doi: 10.1021/acsami.1c09879
Type
Article
Author Keywords
stretchable electronicsresistive strain sensorwearable electronicstextile electronicsfiber strain sensor
Keywords
ASCORBIC-ACIDHYDRAZINETRANSPORTBATTERYSAFETY
ISSN
1944-8244
Abstract
Wearable electronic devices have attracted significant attention as important components in several applications. Among various wearable electronic devices, interest in textile electronic devices is increasing because of their high deformability and portability in daily life. To develop textile electronic devices, fiber-based electronic devices should be fundamentally studied. Here, we report a stretchable and sensitive fiber strain sensor fabricated using only harmless materials during an in situ formation process. Despite using a mild and harmless reducing agent instead of typical strong and hazardous reducing agents, the developed fiber strain sensors feature a low initial electrical resistance of 0.9 ω/cm, a wide strain sensing range (220%), high sensitivity (∼5.8 × 104), negligible hysteresis, and high stability against repeated stretching-releasing deformation (5000 cycles). By applying the fiber sensors to various textiles, we demonstrate that the smart textile system can monitor various gestures in real-time and help users maintain accurate posture during exercise. These results will provide meaningful insights into the development of next-generation wearable applications. © 2021 American Chemical Society.
URI
http://hdl.handle.net/20.500.11750/15368
DOI
10.1021/acsami.1c09879
Publisher
American Chemical Society
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이재홍
Lee, Jaehong이재홍

Department of Robotics and Mechatronics Engineering

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