DGIST Scholar: Micro-Patterning of Copper Nanowire Electrodes Using Reverse Offset Printing

Department of Energy Science and Engineering Theses Master

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Micro-Patterning of Copper Nanowire Electrodes Using Reverse Offset Printing

Title: Micro-Patterning of Copper Nanowire Electrodes Using Reverse Offset Printing

Alternative Title: 리버스 옵셋 프린팅을 통한 구리 나노와이어 미세패턴 전극 제작

Author(s): Inkook Hwang

DGIST Authors: Inkook Hwang ; Youngu Lee ; Sohee Kim

Advisor: 이윤구

Co-Advisor(s): Sohee Kim

Issued Date: 2021

Awarded Date: 2021/02

Type: Thesis

Subject: Copper nanowire, Reverse offset printing, Micropatterning, Intense pulsed light irradiation , 구리 나노와이어, 리버스 옵셋 프린팅, 미세패턴, 광 소결 처리

Table Of Contents: I. Introduction 1
1.1 Metal nanowire transparent electrodes 1
1.2 Solution process 2
1.3 Reverse offset printing 2
II. Theoretical background 4
2.1 Metal nanowire TCEs 4
2.1.1 Electrical properties 4
2.1.2 Optical properties 4
2.1.3 Mechanical properties 5
2.2 CuNWs 7
2.2.1 Synthesis methods of CuNWs 8
2.2.2 Physical property control of CuNWs 9
2.2.3 CuNW TCEs 9
2.3 Micro patterning of metal NWs 12
2.3.1 Inkjet printing 13
2.3.2 Gravure printing 13
2.3.3 Screen printing 14
2.3.4 Reverse offset printing 14
III. Experimental 17
3.1 Chemicals and materials 17
3.2 Preparation of CuNWs solution for ink 17
3.2.1 CuNWs synthesis 17
3.2.2 Ligand exchange of CuNWs 17
3.2.3 Preparation of high concentration CuNWs solution 18
3.3 Preparation of CuNW ink 18
3.4 Reverse offset printing of CuNW ink18
3.5 IPL irradiation 18
3.6 Characterization of reverse offset printed CuNW TCE 19
IV. Result and discussions 20
4.1 Preparation of CuNWs solution for reverse offset ink 20
4.1.1 CuNWs synthesis 20
4.1.2 Ligand exchange of CuNWs 21
4.1.3 Preparation of high concentration CuNWs solution 22
4.2 CuNW micro-pattern fabrication using reverse offset printing 24
4.3 CuNW ink optimizing for reverse offset printing 26
4.3.1 IPA as a major solvent 26
4.3.2 BYK 333 as a surface energy modifier 26
4.3.3 PGMAC as a high boiling solvent 29
4.3.4 BYK 3441 as a cohesive force modifier 31
4.4 Reverse offset printed CuNW micro-patterns 33
4.5 IPL irradiation of CuNW micro-patterns 37
4.6 Stability of reverse offset printed CuNW TCE 39
4.6.1 Oxidation test 39
4.6.2 Tape taping test 40
4.6.3 Bending test 42
V. Conclusion 43
References 44