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dc.contributor.author Choi, Eunmi -
dc.contributor.author Kim, Hayeong -
dc.contributor.author Maeng, SeonJeong -
dc.contributor.author Lee, Jaebaek -
dc.contributor.author Kim, Dae-Hwan -
dc.contributor.author Heo, Kyuyoung -
dc.contributor.author Yun, Ju-Young -
dc.date.accessioned 2023-01-11T11:40:12Z -
dc.date.available 2023-01-11T11:40:12Z -
dc.date.created 2022-08-08 -
dc.date.issued 2022-08 -
dc.identifier.issn 2352-4928 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/17396 -
dc.description.abstract In this study, the thermal stability of cyclopentadienyl tris(dimethylamino)zirconium (CpZr(NMe2)3), a representative precursor for the deposition of ZrO2 films, was evaluated after exposure to thermal stress. As a result, we predicted that dimethylamine, and trimethylamine may be generated when CpZr(NMe2)3 was heated. These impurities affect the growth of film and the properties of the film. In particular, by changing the vapor pressure of CpZr(NMe2)3, thin films with different characteristics are formed under the same process conditions, and consequently, the reliability of the device was also reduced. Therefore, this study demonstrates that the decomposition of precursors must be studied to develop new precursors and highly reliable thin films and devices. © 2022 The Authors -
dc.language English -
dc.publisher Elsevier BV -
dc.title The effects of decomposition of CpZr(NMe2)3 on atomic layer deposition for high-k ZrO2 thin films -
dc.type Article -
dc.identifier.doi 10.1016/j.mtcomm.2022.104008 -
dc.identifier.wosid 000836168100003 -
dc.identifier.scopusid 2-s2.0-85134662395 -
dc.identifier.bibliographicCitation Materials Today Communications, v.32 -
dc.description.isOpenAccess TRUE -
dc.subject.keywordAuthor Atomic layer deposition -
dc.subject.keywordAuthor Decomposition -
dc.subject.keywordAuthor High-k -
dc.subject.keywordAuthor Precursor -
dc.subject.keywordAuthor Thermal stability -
dc.subject.keywordPlus CYCLOPENTADIENYL -
dc.subject.keywordPlus PRECURSORS -
dc.subject.keywordPlus ALD -
dc.citation.title Materials Today Communications -
dc.citation.volume 32 -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.relation.journalResearchArea Materials Science -
dc.relation.journalWebOfScienceCategory Materials Science, Multidisciplinary -
dc.type.docType Article -
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