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Development of novel coatable compatibilized polyimide-modified silica nanocomposites

Title
Development of novel coatable compatibilized polyimide-modified silica nanocomposites
Author(s)
Akhter, T[Akhter, Toheed]Siddiqi, HM[Siddiqi, Humaira Masood]Saeed, S[Saeed, Shaukat]Park, OO[Park, O. Ok]Mun, SC[Mun, Sung Cik]
DGIST Authors
Park, OO[Park, O. Ok]
Issued Date
2014-04-30
Type
Article
Article Type
Article
Subject
Chemical InteractionsChemical ModificationCoatable PolyimideHybrid SystemsHydrogen BondsInterfacial InteractionLike-Like Chemical InteractionsModified SilicaModified Silica ReinforcementNanocompositesOrganic ModificationPhase ConnectivitiesPI-SiO2 CompositesPolyimidePolyimidesPyromellitic DianhydrideReinforcementSilicaSilica NanocompositesStructural Similarity
ISSN
1022-9760
Abstract
A series of novel coatable polyimide silica (PI-SiO2) nanocomposites have been synthesized. A new PI matrix, containing pendant hydroxyl groups, was prepared reacting diamine monomers (4,4'-diamino-4"- hydroxytriphenylmethane, and 4,4'- oxydianiline) and pyromellitic dianhydride (PMDA). Whereas, silica reinforcement was generated using TEOS. A coupling oligomeric species 2,6-bis(3-(triethoxysilyl)propyl)pyrrolo[3,4- f]isoindole-1,3,5,7(2H,6H)-tetraone (APA) was used to furnish silica nanoparticles with imide linkages and hydroxyl groups. As these groups are already present in PI matrix, so their presence in nanoparticles brought structural similarity, and hence enhanced phase connectivity among two phases. The resulting PI-SiO2 hybrids, with improved interfacial interactions through hydrogen bonding and like-like chemical interactions, displayed much enhanced morphological, thermomechanical, and thermal properties. The properties of resulting hybrids were studied by various advanced techniques and compared with PI-SiO2 hybrid system which was prepared from same polyimide and unmodified silica network.© Springer Science+Business Media Dordrecht 2014.
URI
http://hdl.handle.net/20.500.11750/3096
DOI
10.1007/s10965-014-0459-7
Publisher
Springer
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