DGIST Scholar: Synthesis, Assembly and Device Engineering of Copper and Silver Nanowires for Advanced Electronic Applications

Department of Energy Science and Engineering Theses Ph.D.

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Synthesis, Assembly and Device Engineering of Copper and Silver Nanowires for Advanced Electronic Applications

Title: Synthesis, Assembly and Device Engineering of Copper and Silver Nanowires for Advanced Electronic Applications

Author(s): Jongyoun Kim

DGIST Authors: Jongyoun Kim ; Youngu Lee ; Dae-Hyun Nam

Advisor: 이윤구

Co-Advisor(s): Dae-Hyun Nam

Issued Date: 2023

Awarded Date: 2023-02-01

Type: Thesis

Description: metal nanowires, core-shell structures, reverse offset printing, micropatterns, flexible electronics

Table Of Contents: Ⅰ. INTRODUCTION 1
Ⅱ. THEORETICAL BACKGROUND 3
2.1 Preparation of metal nanowire-based electrodes 3
2.1.1 Synthesis of metal nanowires 4
2.1.2 Modification of metal nanowires 7
2.1.3 Metal nanowire assembly 12
2.1.4 Post treatment for metal nanowire-based electrodes 14
2.2 Metal nanowires for energy & electronic applications 17
2.2.1 Optoelectronics 17
2.2.2 Sensor and circuits 19
2.2.3 Supercapacitor 21
2.2.4 CO2 Conversion Catalysts 23
2.3 Direct printing techniques for metal nanowires 26
2.3.1 Inkjet printing 26
2.3.2 Screen printing 29
2.3.3 Gravure printing 32
2.4 Reverse offset printing 35
2.4.1 Mechanism of reverse offset printing 35
2.4.2 Preparations for reverse offset printing 37
2.4.3 Successful process for reverse offset printing 38
2.5 Conclusions 41
2.6 References 42
Ⅲ. 2D MATERIAL-WRAPPED CU NANOWIRES FOR HIGH-PERFORMANCE FLEXILBE AND TRANSPARENT ENERGY DEVICES 51
3.1 Introduction 51
3.2 Experimental section 54
3.2.1 2D material quantum dot preparation 54
3.2.2 Synthesis of 2D material-wrapped CuNW 54
3.2.3 Characterization of materials and devices 55
3.3 Results and discussion 56
3.4 Conclusions 74
3.5 References 75
Ⅳ. VITAMIN C-NANOCONFINED CU NANOWIRES FOR HIGH CURRENT DENSITY CO2 ELECTROREDUCTION 81
4.1 Introduction 81
4.2 Experimental section 83
4.2.1 Preparation of nanoconfined ascorbic acid 83
4.2.2 Synthesis of surface modified CuNW 83
4.2.3 Characterization of the CuNW catalysts 83
4.2.4 Electrode preparation and electrochemical CO2RR measurement 84
4.3 Results and discussion 86
4.4 Conclusions 100
4.5 References 101
Ⅴ. REVERSE OFFSET PRINTING OFCU NANOWIRE MICROPATTERNS WITH SUB-10 μm RESOLUTION FOR FLEXIBLE TRANPARENT ELECTRONIC DEVICES 107
5.1 Introduction 107
5.2 Experimental section 109
5.2.1 Synthesis of CuNW 109
5.2.2 CuNW ink preparation 109
5.2.3 Printing and Intense pulsed light (IPL) irradiation 110
5.2.4 Characterization of ink and micropatterns 110
5.2.5 Device fabrication 110
5.3 Results and discussion 112
5.4 Conclusions 126
5.5 References 127
Ⅵ. REVERSE OFFSET PRINTING OF AG NANOPARTICLE/AG NANOWIRE HYBRID ICROPATTERNS FOR WEARBLE 5G COMMUNICATED MICRO-CONDUCTORS 132
6.1 Introduction 132
6.2 Experimental section 134
6.2.1 Synthesis of AgNP 134
6.2.2 AgNP/AgNW Ink preparation 134
6.2.3 Reverse offset printing and IPL irradiation 134
6.2.4 Characterization of micropatterns 135
6.2.5 Device fabrication 135
6.3 Results and discussion 136
6.4 Conclusions 153
6.5 References 154
Ⅶ. SUMMARY 158