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Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics

Title
Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics
Author(s)
Lee, Gun-HeeLee, Do HoonJeon, WoojinYoon, JihwanAhn, KwanggukNam, Kum SeokKim, MinKim, Jun KyuKoo, Yong HoeJoo, JinmyoungJung, WooChulLee, JaehongNam, JaewookPark, SeongjunJeong, Jae-WoongPark, Steve
Issued Date
2023-07
Citation
Nature Communications, v.14, no.1
Type
Article
Keywords
MULTIFUNCTIONAL FIBERSCIRCUITSSTRAINSENSOR
ISSN
2041-1723
Abstract
Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes. © 2023, The Author(s).
URI
http://hdl.handle.net/20.500.11750/46610
DOI
10.1038/s41467-023-39928-x
Publisher
Nature Publishing Group
Related Researcher
  • 이재홍 Lee, Jaehong
  • Research Interests Fiber electronics; wearable electronics; soft electronics; conductive fiber; implantable devices; electronic sutures
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Appears in Collections:
Department of Robotics and Mechatronics Engineering Soft Biomedical Devices Lab 1. Journal Articles

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