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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Mugeun | - |
| dc.contributor.author | Kim, Hwajoong | - |
| dc.contributor.author | Kim, Jinho | - |
| dc.contributor.author | Jeong, Minji | - |
| dc.contributor.author | Lee, Jaehong | - |
| dc.date.accessioned | 2024-01-04T10:40:17Z | - |
| dc.date.available | 2024-01-04T10:40:17Z | - |
| dc.date.created | 2023-10-04 | - |
| dc.date.issued | 2023-07-10 | - |
| dc.identifier.isbn | 9781665457330 | - |
| dc.identifier.issn | 2832-8256 | - |
| dc.identifier.uri | http://hdl.handle.net/20.500.11750/47564 | - |
| dc.description.abstract | Various strain sensors have been developed due to their capability to monitor a piece of basic physiological information. However, a lot of existing strain sensor is based on planar soft sensors, which have a few critical challenges such as structural mismatch and stable fixation on the target organ. Here, we present a 1-dimensional and biocompatible capacitive fiber strain sensor. The fiber strain sensor comprises a conductive fiber electrode based on Au, a representative biocompatible material. The structure of the fiber strain sensor is a double helix. The sensor shows high sensitivity of 9.8 and high stability. © 2023 IEEE. | - |
| dc.language | English | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.title | Au-Based Biocompatible Capacitive Strain Sensor | - |
| dc.type | Conference Paper | - |
| dc.identifier.doi | 10.1109/FLEPS57599.2023.10220408 | - |
| dc.identifier.scopusid | 2-s2.0-85171548903 | - |
| dc.identifier.bibliographicCitation | Lee, Mugeun. (2023-07-10). Au-Based Biocompatible Capacitive Strain Sensor. 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023. doi: 10.1109/FLEPS57599.2023.10220408 | - |
| dc.identifier.url | https://epapers2.org/fleps2023/ESR/paper_details.php?paper_id=3055 | - |
| dc.citation.conferencePlace | US | - |
| dc.citation.conferencePlace | Boston | - |
| dc.citation.title | 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 | - |