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Advanced HVPE sublimation sandwich method for Si layer formation on SiC substrates
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Title
Advanced HVPE sublimation sandwich method for Si layer formation on SiC substrates
Issued Date
2024-11
Citation
Park, Seonwoo. (2024-11). Advanced HVPE sublimation sandwich method for Si layer formation on SiC substrates. Journal of the Korean Physical Society, 85(10), 810–824. doi: 10.1007/s40042-024-01170-z
Type
Article
Author Keywords
Advanced hydride vapor-phase epitaxySiC substrateSi layerSublimation sandwich method
Keywords
THICK ALN LAYERSSILICON-CARBIDEEPITAXIAL-GROWTHMECHANICAL-PROPERTIESTHERMAL-STABILITYBULK CRYSTALSKINETICSPHASEGANSUPERSATURATION
ISSN
0374-4884
Abstract
An advanced hydride vapor-phase epitaxy (HVPE) method was used to improve the sublimation sandwich method for the formation of Si layers on SiC substrates. In this study, a graphite boat structure with a vertical source and growth zones was used, and the sublimation sandwich method was improved by directly attaching two substrates (without any spacing between them) differently from that of the existing sublimation sandwich method. After the deposition of the amorphous Si layer (using sputtering) on an SiC substrate, the recrystalline Si layer was formed at a temperature of 1250 °C using a SiCln source. Consequently, an Si layer with characteristics different from those of the sputtered Si layer was grown. The formed Si layer was characterized using field-emission scanning electron microscopy, energy-dispersive spectroscopy, high-resolution X-ray diffraction, X-ray photoelectron spectroscopy, secondary ion mass spectrometry, and atomic force microscopy. Overall, we propose an advanced HVPE sublimation sandwich method for forming Si layers on SiC substrates. © The Korean Physical Society 2024.
URI
http://hdl.handle.net/20.500.11750/57360
DOI
10.1007/s40042-024-01170-z
Publisher
Korean Physical Society
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