Improving uniformity of sputtering ion source using COMSOL Modeling

Abstract

The magnetron sputtering system is widely used in various industrial fields for large-area deposition. The sputtering ion source is a key consumable for thin film deposition in the magnetron sputtering system. The sputtering ion source creates plasma through argon, allowing for physical deposition. In particular, the permanent magnets within the structure of the sputtering ion source significantly influence its performance by generating a magnetic field and facilitating plasma formation. In this experiment, we utilize COMSOL modeling to optimize the position and size of permanent magnets to fabricate a sputtering ion source and compare its performance. By adjusting the Z-axis movement of the outer magnets and the distance between the inner magnets, we optimize the Bx magnetic field component. Based on the simulation results, we fabricate the sputtering ion source. A sample with a photolithography pattern is inserted, and after deposition, we measure the thickness at various locations using AFM to assess uniformity. We observe an improvement in uniformity compared to the existing reference. As a result, we were able to increase the Bx magnetic field component through modifications to the permanent magnets, thereby enhancing uniformity.