A magnetron sputtering apparatus according to an embodiment of the present invention may comprise: a chamber in which a sputtering gas is held and which provides an inner space where a workpiece is placed; an ion source unit which includes a sputtering target that provides a deposition material to the workpiece by an electrical field formed in the inner space and a magnet that is disposed on one side of the sputtering target and forms a magnetic field; a power supply unit which provides power to the ion source unit side; and a cooling unit which includes a cooling device provided outside the chamber and a metallic cold head connected from the cooling device directly to the ion source unit in the inner space, thus not needing to introduce a refrigerant.
