Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Jin, Da Woon | - |
dc.contributor.author | Ko, Young Joon | - |
dc.contributor.author | Kong, Dae Sol | - |
dc.contributor.author | Kim, Hyun Ki | - |
dc.contributor.author | Ha, Jae-Hyun | - |
dc.contributor.author | Lee, Minbaek | - |
dc.contributor.author | Hong, Jung-Il | - |
dc.contributor.author | Jung, Jong Hoon | - |
dc.date.accessioned | 2018-10-11T02:02:36Z | - |
dc.date.available | 2018-10-11T02:02:36Z | - |
dc.date.created | 2018-09-28 | - |
dc.date.issued | 2018-12 | - |
dc.identifier.issn | 1567-1739 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11750/9327 | - |
dc.description.abstract | In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive thermal cycling. A 20-μm-thick sheet of mica is flexible even up to the bending radius of 5 mm, and it is durable for 20,000 cycles of up- and down-bending. In addition, the mica shows flexibility at 10 and 773 K, and thermal cycling stability for the temperature variation of ca. 400 K. Compared with the widely used flexible polyimide, mica has a significantly higher Young's modulus (ca. 5.4 GPa) and negligible hysteresis in the force-displacement curve. These results show that mica should be a suitable substrate for piezoelectric energy-harvesting applications of ferroelectric oxide thin films at extremely low and high temperatures. © 2018 Korean Physical Society | - |
dc.language | English | - |
dc.publisher | Elsevier B.V. | - |
dc.title | Thermal stability and Young's modulus of mechanically exfoliated flexible mica | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.cap.2018.09.002 | - |
dc.identifier.scopusid | 2-s2.0-85053039919 | - |
dc.identifier.bibliographicCitation | Current Applied Physics, v.18, no.12, pp.1486 - 1491 | - |
dc.identifier.kciid | ART002414569 | - |
dc.description.isOpenAccess | FALSE | - |
dc.subject.keywordAuthor | Flexible mica | - |
dc.subject.keywordAuthor | Thermal stability | - |
dc.subject.keywordAuthor | Young&apos | - |
dc.subject.keywordAuthor | s modulus | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.citation.endPage | 1491 | - |
dc.citation.number | 12 | - |
dc.citation.startPage | 1486 | - |
dc.citation.title | Current Applied Physics | - |
dc.citation.volume | 18 | - |
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