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dc.contributor.author Nandanapalli, Koteeswara Reddy ko
dc.contributor.author Mudusu, Devika ko
dc.contributor.author Reddy, Gunasekhar K. ko
dc.date.accessioned 2019-06-21T05:15:05Z -
dc.date.available 2019-06-21T05:15:05Z -
dc.date.created 2019-06-20 -
dc.date.issued 2019-09 -
dc.identifier.citation Materials Science in Semiconductor Processing, v.100, pp.192 - 199 -
dc.identifier.issn 1369-8001 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/9993 -
dc.description.abstract Eco-friendly and efficient rectifying p-n diodes have been developed by using cost-effective and non-toxic fin monosulfide (SnS) thin films. Chemically stoichiometric fin monosulfide (SnS) thin films followed by titanium/gold (Ti/Au) bilayer contacts were deposited on Si substrates and then, the structures were treated by rapid thermal annealing process (RTP) at different temperatures. The impact of RTP treatment on the surface morphology and chemical composition of Ti/Au contacts and SnS films along with their electrical characteristics were investigated. The electrical measurements show that as compared to untreated Si/SnS/Ti/Au structures, the heat-treated structures typically at 200 degrees C possess low electrical resistivity and contact resistance of similar to 3 x 10(-2) Omega cm and similar to 11 k Omega, respectively. Heterojunction formed between p-SnS and n-Si exhibited excellent diode characteristics and possess a high current flow in the order of milliamperes, and excellent rectification factor of 1177@ 5 V. -
dc.language English -
dc.publisher Pergamon Press -
dc.title Low-cost and nontoxic highly rectifying diodes using p-type tin monosulfide (SnS) thin films and Ti/Au binary contacts -
dc.type Article -
dc.identifier.doi 10.1016/j.mssp.2019.05.001 -
dc.identifier.wosid 000470108600026 -
dc.identifier.scopusid 2-s2.0-85065526220 -
dc.type.local Article(Overseas) -
dc.type.rims ART -
dc.description.journalClass 1 -
dc.contributor.nonIdAuthor Reddy, Gunasekhar K. -
dc.identifier.citationVolume 100 -
dc.identifier.citationStartPage 192 -
dc.identifier.citationEndPage 199 -
dc.identifier.citationTitle Materials Science in Semiconductor Processing -
dc.type.journalArticle Article -
dc.description.isOpenAccess N -
dc.subject.keywordAuthor Absorber materials -
dc.subject.keywordAuthor SnS films -
dc.subject.keywordAuthor Low-resistive contacts -
dc.subject.keywordAuthor Metallization -
dc.subject.keywordAuthor Heterojunction devices -
dc.subject.keywordPlus ATOMIC LAYER DEPOSITION -
dc.subject.keywordPlus ELECTRICAL-PROPERTIES -
dc.subject.keywordPlus SUBSTRATE -
dc.subject.keywordPlus SURFACE -
dc.subject.keywordPlus GROWTH -
dc.subject.keywordPlus ELECTRODEPOSITION -
dc.subject.keywordPlus HETEROSTRUCTURE -
dc.subject.keywordPlus FABRICATION -
dc.subject.keywordPlus MONOLAYER -
dc.subject.keywordPlus MECHANISM -
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