정석환
Chung, Seok-Hwan학력
- 1997 ~ 2003University of Maryland, College Park 박사
- 1990 ~ 1996서울대학교 학사
경력
- 2011 ~ Current대구경북과학기술원 (DGIST) / 선임연구원
- 2009 ~ 2011University of Maryland / Assistant Research Scientist
- 2006 ~ 2009National Institute of Standards and Technology / Assistant Research Scientist
- 2003 ~ 2006Argonne National Laboratory / Postdoctoral Appointee
수상실적
Research Interests
Related Keyword
- "Low magnetic field alignment of carbon fibers in a polymer matrix for high-performance thermal interface materials", Chung, Seok-Hwan. (2024-12). Low magnetic field alignment of carbon fibers in a polymer matrix for high-performance thermal interface materials. Journal of Alloys and Compounds, 1009. doi: 10.1016/j.jallcom.2024.176888
- "Electrical transport phenomena in two-dimensional metallic 2H-NbSe2: an experimental and theoretical study", Kim, Jeongmin. (2024-12). Electrical transport phenomena in two-dimensional metallic 2H-NbSe2: an experimental and theoretical study. Nanoscale, 16(48), 22230–22239. doi: 10.1039/d4nr03369h
- "Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste", Chung, Seok-Hwan. (2023-03). Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste. Materials Today Communications, 34. doi: 10.1016/j.mtcomm.2023.105463
- "Magnetic alignment of graphite platelets in polyimide matrix toward a flexible electronic substrate with enhanced thermal conductivity", Chung, Seok-Hwan. (2022-03). Magnetic alignment of graphite platelets in polyimide matrix toward a flexible electronic substrate with enhanced thermal conductivity. Materials Today Communications, 30. doi: 10.1016/j.mtcomm.2021.103026
- "High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding", Chung, Seok-Hwan. (2022-03). High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding. Journal of Alloys and Compounds, 896. doi: 10.1016/j.jallcom.2021.163060
연구분야
미래유망 신기술(6T)
국가과학기술표준분류
12대 국가전략기술 분야