Browsing by Titles

Showing results 1 to 6 of 6

  • Cassuto, Yuval
  • Kim, Yongjune
  • 2021-07-17
  • Cassuto, Yuval. (2021-07-17). Boosting for Straggling and Flipping Classifiers. 2021 IEEE International Symposium on Information Theory, ISIT 2021, 2441–2446. doi: 10.1109/isit45174.2021.9517745
  • IEEE Information Theory Society
  • View : 278
  • Download : 0
  • Kim, Yongjune
  • Shin, Junyoung
  • Cassuto, Yuval
  • Varshney, Lav R.
  • 2023-01
  • Kim, Yongjune. (2023-01). Distributed Boosting Classification over Noisy Communication Channels. IEEE Journal on Selected Areas in Communications, 41(1), 141–154. doi: 10.1109/JSAC.2022.3221972
  • Institute of Electrical and Electronics Engineers
  • View : 94
  • Download : 0
  • Woo, Jiheon
  • Yoo, Chanhee
  • Kim, Young-Sik
  • Cassuto, Yuval
  • Kim, Yongjune
  • 2022-06-27
  • Woo, Jiheon. (2022-06-27). Generalized Longest Repeated Substring Min-Entropy Estimator. 2022 IEEE International Symposium on Information Theory, ISIT 2022, 342–347. doi: 10.1109/ISIT50566.2022.9834465
  • IEEE Information Theory Society
  • View : 292
  • Download : 0
  • Woo, Jiheon
  • Yoo, Chanhee
  • Kim, Young-Sik
  • Cassuto, Yuval
  • Kim, Yongjune
  • 2023-05
  • IEEE Transactions on Information Forensics and Security, v.18, pp.3305 - 3317
  • Institute of Electrical and Electronics Engineers Inc.
  • View : 176
  • Download : 0
  • Ben-Hur, Yuval
  • Goren, Asaf
  • Klang, Da El
  • Kim, Yongjune
  • Cassuto, Yuval
  • 2022-06-30
  • Ben-Hur, Yuval. (2022-06-30). Mitigating Noise in Ensemble Classification with Real-Valued Base Functions. 2022 IEEE International Symposium on Information Theory, ISIT 2022, 2279–2284. doi: 10.1109/ISIT50566.2022.9834480
  • IEEE Information Theory Society
  • View : 55
  • Download : 0
  • Kim, Yongjune
  • Jeon, Yoocharn
  • Choi, Hyeokjin
  • Guyot, Cyril
  • Cassuto, Yuval
  • 2022-09
  • Kim, Yongjune. (2022-09). Optimizing Write Fidelity of MRAMs by Alternating Water-filling Algorithm. IEEE Transactions on Communications, 70(9), 5825–5836. doi: 10.1109/TCOMM.2022.3190868
  • Institute of Electrical and Electronics Engineers
  • View : 225
  • Download : 0
1