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Article
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun ; 
  • Kim, Woo Kyoung
  • 2012-10
  • Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
  • Elsevier BV
  • View : 1017
  • Download : 0
Article
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Choi, Kyu-Jeong ; 
  • Shin, Woong-Chul ; 
  • Kim, Jae Hyun ; 
  • Lee, Do-Joong ; 
  • Kim, Ki-Bum ; 
  • Sohn, Hyunchul ; 
  • Kim, Soo-Hyun
  • 2009
  • Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
  • Electrochemical Society
  • View : 409
  • Download : 0
Article
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Choi, Kyu-Jeong ; 
  • Shin, Woong-Chul ; 
  • Kim, Jae Hyun ; 
  • Lee, Do-Joong ; 
  • Kim, Ki-Bum ; 
  • Sohn, Hyunchul ; 
  • Kim, Soo-Hyun
  • 2009
  • Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
  • Electrochemical Society
  • View : 994
  • Download : 0
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