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Article
Atomic layer deposition of Ru thin film using N-2/H-2 plasma as a reactant
  • Hong, TE[Hong, Tae Eun] ; 
  • Mun, KY[Mun, Ki-Yeung] ; 
  • Choi, SK[Choi, Sang-Kyung] ; 
  • Park, JY[Park, Ji-Yoon] ; 
  • Kim, SH[Kim, Soo-Hyun] ; 
  • Cheon, T[Cheon, Taehoon] ; 
  • Kim, WK[Kim, Woo Kyoung] ; 
  • Lim, BY[Lim, Byoung-Yong] ; 
  • Kim, S[Kim, Sunjung]
  • 2012-07-31
  • Hong, TE[Hong, Tae Eun]. (2012-07-31). Atomic layer deposition of Ru thin film using N-2/H-2 plasma as a reactant. doi: 10.1016/j.tsf.2012.05.069
  • ELSEVIER SCIENCE SA
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Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1071
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Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1150
  • Download : 0
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