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Article
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun ; 
  • Kim, Woo Kyoung
  • 2012-10
  • Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
  • Elsevier BV
  • View : 908
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Article
Cobalt titanium nitride amorphous metal alloys by atomic layer deposition
  • Nam, Taewook ; 
  • Lee, Chang Wan ; 
  • Cheon, Taehoon ; 
  • Lee, Woo Jae ; 
  • Kim, Soo-Hyun ; 
  • Kwon, Se-Hun ; 
  • Lee, Han-Bo-Ram ; 
  • Kim, Hyungjun
  • 2018-03
  • Nam, Taewook. (2018-03). Cobalt titanium nitride amorphous metal alloys by atomic layer deposition. Journal of Alloys and Compounds, 737, 684–692. doi: 10.1016/j.jallcom.2017.12.023
  • Elsevier BV
  • View : 558
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Article
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
  • Mun, Ki-Yeung ; 
  • Hong, Tae Eun ; 
  • Cheon, Taehoon ; 
  • Jang, Yujin ; 
  • Lim, Byoung-Yong ; 
  • Kim, Sunjung ; 
  • Kim, Soo-Hyun
  • 2014-07-01
  • Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
  • Elsevier
  • View : 748
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