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Cobalt titanium nitride amorphous metal alloys by atomic layer deposition

Title
Cobalt titanium nitride amorphous metal alloys by atomic layer deposition
Authors
Nam, TaewookLee, Chang WanCheon, TaehoonLee, Woo JaeKim, Soo-HyunKwon, Se-HunLee, Han-Bo-RamKim, Hyungjun
DGIST Authors
Nam, Taewook; Lee, Chang Wan; Cheon, Taehoon; Lee, Woo Jae; Kim, Soo-Hyun; Kwon, Se-Hun; Lee, Han-Bo-Ram; Kim, Hyungjun
Issue Date
2018-03
Citation
Journal of Alloys and Compounds, 737, 684-692
Type
Article
Author Keywords
Amorphous metal alloyMetal-metal nitride alloyCoTiNAtomic layer depositionInterlayer formationDiffusion barrier
Keywords
TIN THIN-FILMSDIFFUSION-BARRIERSCU METALLIZATIONBIS(N-TERT-BUTYL-N&apos-ETHYLPROPIONAMIDINATO) COBALT(II)MECHANICAL-PROPERTIESGROWTH-RATECOPPERNANOINDENTATIONPHASETA
ISSN
0925-8388
Abstract
The formation of thin amorphous cobalt titanium nitride (CoTiN) layers was investigated using a supercycle method of atomic layer deposition (ALD). The stoichiometry of the resultant ALD CoTiN films was controlled by changing the ratio of Co and TiN thicknesses. X-ray diffraction analysis and transmission electron microscopy observations showed that the microstructure of the ALD Co and TiN was transformed from polycrystalline to amorphous CoTiN. The stoichiometry of the CoTiN layer was affected by the growth characteristics of ALD Co and TiN on each surface. The results revealed that ALD TiN undergoes nucleation incubation on the ALD Co surface, whereas ALD Co does not undergo nucleation incubation on the ALD TiN surface. The properties of the amorphous CoTiN layers were evaluated by diffusion experiments and mechanical tests. Because of the lack of grain boundaries, the CoTiN efficiently blocks the diffusion of Cu at elevated temperatures and exhibits higher hardness compared with ALD Co. (c) 2017 Elsevier B.V. All rights reserved.
URI
http://hdl.handle.net/20.500.11750/13874
DOI
10.1016/j.jallcom.2017.12.023
Publisher
Elsevier BV
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