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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Cheon, Taehoon ; 
  • Kim, Soo-Hyun ; 
  • Kim, Woo Kyoung
  • 2012-10
  • Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
  • Elsevier BV
  • View : 879
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Article
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization
  • Yeo, Seungmin ; 
  • Choi, Sang-Hyeok ; 
  • Park, Ji-Yoon ; 
  • Kim, Soo-Hyun ; 
  • Cheon, Taehoon ; 
  • Lim, Byoung-Yong ; 
  • Kim, Sunjung
  • 2013-11
  • Yeo, Seungmin. (2013-11). Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization. doi: 10.1016/j.tsf.2013.03.074
  • Elsevier BV
  • View : 731
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Article
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
  • Mun, Ki-Yeung ; 
  • Hong, Tae Eun ; 
  • Cheon, Taehoon ; 
  • Jang, Yujin ; 
  • Lim, Byoung-Yong ; 
  • Kim, Sunjung ; 
  • Kim, Soo-Hyun
  • 2014-07-01
  • Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
  • Elsevier
  • View : 710
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